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ADS8472IRGZR

Texas Instruments

ADS8472IRGZR by Texas Instruments

Texas Instruments ADS8472IRGZR is a 16-bit ADC with 0.0015% EL, 1 MHz sample rate, and 3.3 V supply voltage. Ideal for industrial applications requiring high precision analog-to-digital conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,515 parts In-Stock

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3,515

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Vyrian

USA . 2,234 parts In-Stock

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2,234

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Distributors (Availability)

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Northwest PG Solutions

USA . 253 parts In-Stock

1+ parts

$2.794

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253

$2.794

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Parana Technologies

USA . 320 parts In-Stock

1+ parts

$10.417

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-

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$10.930

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320

$10.417

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$10.930

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DigiPath Technology Company

USA . 1,776 parts In-Stock

1+ parts

$11.471

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1,776

$11.471

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ChromeModa Solutions

Germany . 3,215 parts In-Stock

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$11.705

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$9.598

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3,215

$11.705

$9.598

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

1+ parts

$11.705

100+ parts

$11.120

1k+ parts

$10.534

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1,028

$11.705

$11.120

$10.534

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One Stop Electronics

USA . 299 parts In-Stock

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$12.000

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299

$12.000

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AZTECH Wire

Italy . 455 parts In-Stock

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$14.329

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455

$14.329

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Component Stockers USA

USA . 254 parts In-Stock

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$99.990

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254

$99.990

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A-Z Elektronik GmbH

Germany . 5,633 parts In-Stock

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Lixinc

USA . 4,019 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,755 parts In-Stock

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Corphita

USA . 3,269 parts In-Stock

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Microchip USA

USA . 965 parts In-Stock

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965

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Native Components

USA . 370 parts In-Stock

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$2.464

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370

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$2.464

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Overview

Unlock unparalleled precision and performance with the ADS8472IRGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that are ideal for a wide range of applications. This innovative product boasts exceptional linearity and speed, making it perfect for demanding industrial environments. With a compact design and advanced features, the ADS8472IRGZR offers unmatched value and reliability to customers looking to elevate their systems to the next level. Trust Texas Instruments to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the components inside the package.

No. of Bits: 16

Provides high resolution and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.0015 %

Ensures minimal error in the conversion process, leading to accurate digital representation of analog inputs.

Power Supplies (V): 3/5,5

Offers flexibility in power supply options for different applications.

Maximum Operating Temperature: 85 °C

Allows the converter to operate in a wide range of temperature environments, suitable for industrial use.

Sample Rate: 1 MHz

High sample rate allows for capturing fast-changing analog signals accurately.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Analog-to-Digital Converters ADS8472IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0015 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

650 ns

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

-4.45 V

Maximum Analog Input Voltage:

4.45 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8472IRGZR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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