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ADS8401IBPFBRG4

Texas Instruments

ADS8401IBPFBRG4 by Texas Instruments

Texas Instruments ADS8401IBPFBRG4 is a 16-bit ADC with 0.0053% EL, 1.25 MHz sample rate, and 0.61 us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,117 parts In-Stock

1+ parts

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4,117

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Vyrian

USA . 2,306 parts In-Stock

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2,306

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Distributors (Availability)

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Native Components

USA . 719 parts In-Stock

1+ parts

$0.866

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-

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719

$0.866

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Northwest PG Solutions

USA . 1,357 parts In-Stock

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$0.953

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1,357

$0.953

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AZTECH Wire

Italy . 196 parts In-Stock

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$5.048

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196

$5.048

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One Stop Electronics

USA . 470 parts In-Stock

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$20.000

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470

$20.000

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Parana Technologies

USA . 1,721 parts In-Stock

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$21.109

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$21.369

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1,721

$21.109

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$21.369

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$23.244

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1,384

$23.244

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ChromeModa Solutions

Germany . 3,279 parts In-Stock

1+ parts

$23.718

100+ parts

$19.449

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3,279

$23.718

$19.449

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IDEA Electronic Components Group

UK . 130 parts In-Stock

1+ parts

$23.718

100+ parts

$22.532

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$21.346

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130

$23.718

$22.532

$21.346

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Corphita

USA . 1,476 parts In-Stock

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1,476

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Microchip USA

USA . 156 parts In-Stock

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Overview

Unlock the power of precision with the ADS8401IBPFBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that are perfect for a wide range of applications. Whether you're working on industrial automation, medical equipment, or telecommunications, this converter offers unmatched accuracy and reliability. Experience seamless integration and high performance with this innovative product, providing you with the value and benefits you need to stay ahead in today's competitive market. Elevate your designs with the ADS8401IBPFBRG4 and unleash your full potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient integration into circuit boards.

No. of Bits: 16

Provides high resolution and accuracy for precision data conversion.

Maximum Linearity Error (EL): 0.0053 %

Ensures accurate conversion of analog signals with minimal error.

Power Supplies (V): 3/5,5

Provides flexibility in power requirements for different applications.

No. of Terminals: 48

Offers multiple connection points for versatile connectivity options.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be a factor.

Minimum Operating Temperature: -40 °C

Suitable for operation in a wide range of temperature environments.

Maximum Conversion Time: 0.61 us

Provides fast conversion speed for real-time data processing.

Width: 7 mm

Compact size for space-constrained applications.

Length: 7 mm

Compact size for space-constrained applications.

Sample Rate: 1.25 MHz

High sample rate for capturing fast-changing analog signals.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes a proven method for accurate analog-to-digital conversion.

Technical Specifications

Analog-to-Digital Converters ADS8401IBPFBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0053 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

610 ns

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8401IBPFBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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