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ADS8383IBPFBR

Texas Instruments

ADS8383IBPFBR by Texas Instruments

Texas Instruments ADS8383IBPFBR is an 18-bit ADC with 0.0027% EL, 1.52us conversion time, and 0.5MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact 48-terminal package with 5V nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,401 parts In-Stock

1+ parts

-

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8,401

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Digiode

USA . 3,575 parts In-Stock

1+ parts

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3,575

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 493 parts In-Stock

1+ parts

$0.081

100+ parts

-

1k+ parts

-

10k+ parts

$0.078

493

$0.081

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-

$0.078

Northwest PG Solutions

USA . 1,085 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

$0.079

1,085

$0.089

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-

$0.079

AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$13.519

100+ parts

-

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594

$13.519

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Parana Technologies

USA . 332 parts In-Stock

1+ parts

$22.325

100+ parts

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$22.998

10k+ parts

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332

$22.325

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$22.998

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ChromeModa Solutions

Germany . 3,098 parts In-Stock

1+ parts

$25.084

100+ parts

$20.569

1k+ parts

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3,098

$25.084

$20.569

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IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$25.084

100+ parts

$23.830

1k+ parts

$22.576

10k+ parts

-

986

$25.084

$23.830

$22.576

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One Stop Electronics

USA . 1,447 parts In-Stock

1+ parts

$35.000

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1,447

$35.000

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Component Stockers USA

USA . 427 parts In-Stock

1+ parts

$99.990

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427

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,537 parts In-Stock

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29,537

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Microchip USA

USA . 6,775 parts In-Stock

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6,775

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Corphita

USA . 4,000 parts In-Stock

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4,000

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DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

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100+ parts

$22.616

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333

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$22.616

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Overview

Elevate your analog-to-digital conversion experience with the ADS8383IBPFBR by Texas Instruments. Crafted with precision and reliability, this ADC promises unparalleled accuracy and performance. Whether you're designing industrial automation systems or medical instruments, this converter ensures seamless integration and exceptional results. Say goodbye to compromise and hello to excellence with Texas Instruments' cutting-edge technology. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the converter.

No. of Bits: 18

High number of bits allows for more precise and accurate conversion of analog signals to digital.

Maximum Linearity Error (EL): 0.0027%

Very low linearity error ensures accurate conversion of analog input signals.

Power Supplies (V): 3/5,5

Compatible with a range of power supplies, offering flexibility in usage.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, making it suitable for various applications.

Sample Rate: 0.5 MHz

High sample rate allows for fast and efficient conversion of analog signals.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Uses a reliable and precise conversion method, producing accurate digital outputs.

Technical Specifications

Analog-to-Digital Converters ADS8383IBPFBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0027 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.52 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8383IBPFBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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