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ADS8341E/2K5G4

Texas Instruments

ADS8341E/2K5G4 by Texas Instruments

The Texas Instruments ADS8341E/2K5G4 is a 16-bit ADC with 4 analog input channels, operating at a sample rate of 0.1 MHz. It features a max linearity error of 0.0122%, suitable for industrial applications requiring precise analog-to-digital conversion within the temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 5,250 parts In-Stock

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Vyrian

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France . 3,064 parts In-Stock

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Digiode

USA . 1,787 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 510 parts In-Stock

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$5.000

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Ampacity Inc.

Singapore . 1,464 parts In-Stock

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Corohmni

South Africa . 104 parts In-Stock

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$18.496

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AZTECH Wire

Italy . 625 parts In-Stock

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$19.385

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Parana Technologies

USA . 2,074 parts In-Stock

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$22.645

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$23.303

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DigiPath Technology Company

USA . 1,991 parts In-Stock

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$24.935

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ChromeModa Solutions

Germany . 6,737 parts In-Stock

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IDEA Electronic Components Group

UK . 1,840 parts In-Stock

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Component Stockers USA

USA . 388 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,570 parts In-Stock

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Argo Parts USA

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Microchip USA

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Continental Prestige Electronics

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Aranea Global

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Advanced Electronics

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Overview

Unlock the power of precision with the ADS8341E/2K5G4 Analog-to-Digital Converter by Texas Instruments. Designed with top-quality materials and cutting-edge technology, this converter offers unparalleled accuracy and reliability for a wide range of applications. From industrial automation to medical devices, this versatile device provides fast and efficient conversion while operating at extreme temperatures. Experience seamless integration and superior performance with the ADS8341E/2K5G4, delivering value and innovation to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the ADC.

No. of Analog In Channels: 4

Allows for multiple analog input signals to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Easy to mount onto circuit boards, saving space and assembly time.

No. of Bits: 16

High resolution for accurate conversion of analog signals to digital values.

Maximum Linearity Error: 0.0122%

Ensures precision in the conversion process, providing accurate digital output.

Power Supplies (V): 2.7/5

Offers flexibility in power supply options for different applications.

No. of Terminals: 16

Sufficient number of terminals for easy connection to external circuitry.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact size and spacing for efficient use of board space.

Minimum Supply Voltage: 2.7 V

Operates at low voltage, saving power and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for use in various environmental conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides reliable electrical connection and corrosion resistance.

Maximum Conversion Time: 6.67 us

Fast conversion time for real-time data acquisition applications.

Maximum Seated Height: 1.75 mm

Low profile design for space-constrained applications.

Width: 3.9 mm

Compact width for easy integration into circuit layouts.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes during assembly.

Length: 4.9 mm

Compact length for space-saving on PCBs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperatures.

Maximum Analog Input Voltage: 5.25 V

Accepts a wide range of analog input voltages for versatile applications.

Sample Rate: 0.1 MHz

High sampling rate for capturing fast-changing analog signals accurately.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Easy to solder onto PCBs for secure connections.

Maximum Supply Current: 2 mA

Low current consumption for energy-efficient operation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes a precise conversion method for accurate digital representation of analog signals.

Nominal Supply Voltage: 5 V

Standard supply voltage for easy integration into existing systems.

Output Bit Code: BINARY

Digital output in binary format for compatibility with digital systems.

Terminal Pitch: 0.635 mm

Fine pitch for compact layout and space-saving on PCBs.

Minimum Analog Input Voltage: 0 V

Accepts zero input voltage for accurate conversion of low-level signals.

Output Format: SERIAL

Serial output format for easy data transmission to external devices.

Sample and Hold/Track and Hold: SAMPLE

Sample-and-hold feature for capturing analog input at precise moments for accurate conversion.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture exposure during handling and storage.

Technical Specifications

Analog-to-Digital Converters ADS8341E/2K5G4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0122 %

Sample Rate:

100 kHz

Hold Mode:

Sample

Maximum Conversion Time:

6.67 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8341E/2K5G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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