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ADS8329IPWG4

Texas Instruments

ADS8329IPWG4 by Texas Instruments

The Texas Instruments ADS8329IPWG4 is a 16-bit ADC with 0.0038% EL, operating at 1MHz sample rate. Ideal for industrial applications, it has a supply voltage range of 1.65-5V and operates b/w -40 to 85°C. With a compact design and low power consumption of 6.1mA, it offers precise analog-to-digital conversion in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,913 parts In-Stock

1+ parts

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8,913

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Digiode

USA . 2,865 parts In-Stock

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2,865

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 430 parts In-Stock

1+ parts

$7.000

100+ parts

-

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430

$7.000

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Parana Technologies

USA . 773 parts In-Stock

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$7.152

100+ parts

-

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$7.662

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773

$7.152

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$7.662

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DigiPath Technology Company

USA . 130 parts In-Stock

1+ parts

$7.875

100+ parts

$7.245

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130

$7.875

$7.245

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IDEA Electronic Components Group

UK . 2,032 parts In-Stock

1+ parts

$8.036

100+ parts

-

1k+ parts

$7.232

10k+ parts

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2,032

$8.036

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$7.232

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ChromeModa Solutions

Germany . 38 parts In-Stock

1+ parts

$8.036

100+ parts

$6.590

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38

$8.036

$6.590

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AZTECH Wire

Italy . 794 parts In-Stock

1+ parts

$12.286

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794

$12.286

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Corphita

USA . 2,963 parts In-Stock

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2,963

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Microchip USA

USA . 1,357 parts In-Stock

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1,357

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Native Components

USA . 424 parts In-Stock

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424

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Northwest PG Solutions

USA . 26 parts In-Stock

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Overview

Elevate your analog-to-digital conversion with the ADS8329IPWG4 by Texas Instruments. Manufactured with precision and reliability in mind, this converter offers exceptional performance for a wide range of applications. Whether you're working in industrial automation, instrumentation, or data acquisition, this product provides unmatched value with its high accuracy and fast conversion times. Trust in Texas Instruments to deliver cutting-edge technology that empowers your designs and ensures success. Choose the ADS8329IPWG4 for quality you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the components inside, ensuring a long lifespan for the product.

No. of Bits: 16

Higher number of bits allows for more precise conversion of analog signals to digital, resulting in accurate data capture.

Maximum Conversion Time: 0.786 us

Fast conversion time allows for quick processing of analog signals, making this product suitable for time-sensitive applications.

Maximum Analog Input Voltage: 5 V

Supports a wide range of analog input voltages, making it versatile for different types of input signals.

Output Bit Code: BINARY

Binary output format simplifies data processing and interpretation, making it compatible with most digital systems.

Sample Rate: 1 MHz

High sample rate allows for capturing fast-changing analog signals accurately, making this product ideal for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADS8329IPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

786 ns

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

6.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8329IPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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