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ADS8328IBPWG4

Texas Instruments

ADS8328IBPWG4 by Texas Instruments

The Texas Instruments ADS8328IBPWG4 is a 16-bit ADC with 2 analog in channels, 0.0031% EL, and 0.5 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package. Operates at -40 to 85°C with low power consumption of 5mA at max.

Median Price

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4

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1k+

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VNN

France . 3,395 parts In-Stock

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Vyrian

USA . 2,667 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 381 parts In-Stock

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$12.485

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One Stop Electronics

USA . 978 parts In-Stock

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Parana Technologies

USA . 969 parts In-Stock

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$13.726

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$14.218

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DigiPath Technology Company

USA . 2,237 parts In-Stock

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$15.115

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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$15.423

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$14.652

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$13.881

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ChromeModa Solutions

Germany . 761 parts In-Stock

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$15.423

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$12.647

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Ampacity Inc.

Singapore . 579 parts In-Stock

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Semicontronic

India . 604 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,544 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Argo Parts USA

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Overview

Unlock the power of precision with the Texas Instruments ADS8328IBPWG4 Analog-to-Digital Converter. This top-of-the-line device boasts unparalleled quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this ADC offers customers unmatched value and benefits. Experience high performance and accuracy without compromise with the ADS8328IBPWG4 – the perfect solution for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for greater flexibility in data acquisition and monitoring multiple signals simultaneously.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into compact circuit designs and saves space on PCB.

No. of Bits: 16

With 16-bit resolution, the product can provide high precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0031 %

The low linearity error ensures that the converted digital data closely represents the original analog input, leading to accurate results.

Power Supplies (V): 1.8/5, 3/5

Supporting multiple voltage options for power supplies enhances compatibility with various systems and voltage requirements.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package style makes it suitable for space-constrained applications and allows for efficient PCB layout.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage requirement enables operation in energy-efficient and low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial environments and ensures reliable performance under varying conditions.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function in extreme temperature conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity, corrosion resistance, and reliability for long-term use.

Maximum Conversion Time: 1.636 us

The fast conversion time ensures quick and efficient processing of analog signals into digital data, ideal for real-time applications.

Maximum Seated Height: 1.2 mm

The low seated height profile allows for a slim and compact form factor, essential for applications with space constraints.

Width: 4.4 mm

The narrow width of 4.4 mm ensures easy integration and placement of the product in tight spaces on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The specified duration for peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the product suitable for lead-free soldering processes and ensures robust construction.

Length: 5 mm

The compact length of 5 mm allows for easy placement and routing on the PCB, optimizing space utilization.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh environmental conditions and demanding applications.

Maximum Analog Input Voltage: 5.5 V

Supporting a maximum analog input voltage of 5.5 V allows for compatibility with a wide range of analog signal sources.

Sample Rate: 0.5 MHz

The high sample rate of 0.5 MHz enables fast and accurate conversion of analog signals, suitable for high-speed data acquisition applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high speed, and reliable performance in digital signal conversion.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and robust mechanical connection in surface-mount applications.

Maximum Supply Current: 5 mA

The low maximum supply current requirement results in energy-efficient operation and minimizes power consumption.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high resolution and accuracy in converting analog signals to digital data, suitable for precision applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7 V ensures compatibility with standard voltage levels and simplifies power supply requirements.

Output Bit Code: BINARY

The output in binary bit code format simplifies data processing and interpretation, ensuring compatibility with digital systems.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65 mm allows for precise connection and compact layout on the PCB for efficient signal routing.

Minimum Analog Input Voltage: 0 V

Supporting a minimum analog input voltage of 0 V enables the product to accurately convert and measure even small analog signals.

Output Format: SERIAL

The serial output format allows for easy interfacing with microcontrollers and digital devices, enabling seamless data transmission.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature ensures accurate sampling and conversion of analog signals at specific time instances, critical for precise data acquisition.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the product is suitable for standard manufacturing processes and storage conditions, ensuring long-term reliability.

Technical Specifications

Analog-to-Digital Converters ADS8328IBPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.636 µs

Electrical Specifications

Power Supplies:

1.8/5,3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8328IBPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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