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ADS8320SKGD2

Texas Instruments

ADS8320SKGD2 by Texas Instruments

The Texas Instruments ADS8320SKGD2 is a 16-bit ADC with 0.034% EL, operating from -55 to 210°C. It features a 0.1 MHz sample rate, BINARY output code, and SERIAL output format. Ideal for military applications requiring precise analog-to-digital conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,121 parts In-Stock

1+ parts

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4,121

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Vyrian

USA . 4,100 parts In-Stock

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4,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$6.082

100+ parts

-

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629

$6.082

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Native Components

USA . 301 parts In-Stock

1+ parts

$9.896

100+ parts

-

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301

$9.896

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Northwest PG Solutions

USA . 124 parts In-Stock

1+ parts

$10.886

100+ parts

$9.797

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124

$10.886

$9.797

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Parana Technologies

USA . 1,088 parts In-Stock

1+ parts

$19.185

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$19.232

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1,088

$19.185

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$19.232

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ChromeModa Solutions

Germany . 3,209 parts In-Stock

1+ parts

$21.556

100+ parts

$17.676

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3,209

$21.556

$17.676

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IDEA Electronic Components Group

UK . 1,020 parts In-Stock

1+ parts

$21.556

100+ parts

$20.478

1k+ parts

$19.400

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1,020

$21.556

$20.478

$19.400

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One Stop Electronics

USA . 1,629 parts In-Stock

1+ parts

$34.000

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1,629

$34.000

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Microchip USA

USA . 2,755 parts In-Stock

1+ parts

$166.580

100+ parts

$162.140

1k+ parts

$159.920

10k+ parts

$157.700

2,755

$166.580

$162.140

$159.920

$157.700

Corphita

USA . 2,671 parts In-Stock

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2,671

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DigiPath Technology Company

USA . 1,631 parts In-Stock

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$19.435

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1,631

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$19.435

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Overview

Experience superior performance with the ADS8320SKGD2 Analog-to-Digital Converter by Texas Instruments. This high-quality device offers precise conversion and reliability, making it ideal for a wide range of applications. With its compact design and advanced technology, this ADC provides unmatched value and benefits to customers seeking efficient data acquisition solutions. Trust in Texas Instruments' expertise and elevate your projects with the ADS8320SKGD2.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and simplifying the assembly process.

No. of Bits: 16

Provides high resolution for accurate analog-to-digital conversion, making it suitable for precision measurement applications.

Maximum Linearity Error (EL): 0.034 %

Ensures that the output digital value closely matches the input analog signal, leading to accurate conversion results.

Sample Rate: 0.1 MHz

Offers a high sampling rate, allowing for real-time conversion of analog signals into digital data.

Technology: CMOS

CMOS technology enables low power consumption and compatibility with a wide range of digital systems.

Maximum Analog Input Voltage: 5.25 V

Supports a wide range of input voltages, making it versatile for different analog signal sources.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADCs are known for their high speed and accuracy in converting analog signals to digital form.

Minimum Supply Voltage: 2.7 V

Operates at a low supply voltage, suitable for battery-powered devices and energy-efficient applications.

Technical Specifications

Analog-to-Digital Converters ADS8320SKGD2 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.034 %

Sample Rate:

100 kHz

Hold Mode:

Sample

Maximum Conversion Time:

6.66667 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

210 °C (410 °F)

Temperature Grade:

Form Factor

Terminal Position:

Upper

No. of Terminals:

8

Terminal Form:

Surface Mount:

Yes

Width:

0.057 in (1.4503 mm)

Length:

0.072 in (1.8204 mm)

Packaging

Package Style:

Uncased Chip

Package Shape:

Package Code:

DIE

Standards and Codes

JESD-30 Code:

R-XUUC-N8

Trade Compliance

ADS8320SKGD2 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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