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ADS8318IDGSR

Texas Instruments

ADS8318IDGSR by Texas Instruments

ADC, SUCCESSIVE APPROXIMATION; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

Median Price

$7.998

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23,510 parts In-Stock

1+ parts

$6.410

100+ parts

$6.280

1k+ parts

$6.150

10k+ parts

-

23,510

$6.410

$6.280

$6.150

-

Texas Instruments

USA . 179,527 parts In-Stock

1+ parts

$9.587

100+ parts

$8.374

1k+ parts

$5.775

10k+ parts

-

179,527

$9.587

$8.374

$5.775

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,557 parts In-Stock

1+ parts

$9.108

100+ parts

-

1k+ parts

-

10k+ parts

-

4,557

$9.108

-

-

-

Vyrian

USA . 8,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,845

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 262 parts In-Stock

1+ parts

$1.740

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$1.740

-

-

-

Northwest PG Solutions

USA . 2,146 parts In-Stock

1+ parts

$1.914

100+ parts

-

1k+ parts

-

10k+ parts

-

2,146

$1.914

-

-

-

Vigor

Singapore . 23,510 parts In-Stock

1+ parts

$7.780

100+ parts

-

1k+ parts

-

10k+ parts

-

23,510

$7.780

-

-

-

Corphita

USA . 2,410 parts In-Stock

1+ parts

$8.628

100+ parts

-

1k+ parts

-

10k+ parts

-

2,410

$8.628

-

-

-

AZTECH Wire

Italy . 1,202 parts In-Stock

1+ parts

$9.030

100+ parts

-

1k+ parts

-

10k+ parts

-

1,202

$9.030

-

-

-

Parana Technologies

USA . 187 parts In-Stock

1+ parts

$9.710

100+ parts

-

1k+ parts

$10.291

10k+ parts

-

187

$9.710

-

$10.291

-

DigiPath Technology Company

USA . 686 parts In-Stock

1+ parts

$10.692

100+ parts

-

1k+ parts

-

10k+ parts

-

686

$10.692

-

-

-

ChromeModa Solutions

Germany . 5,439 parts In-Stock

1+ parts

$10.910

100+ parts

$8.946

1k+ parts

-

10k+ parts

-

5,439

$10.910

$8.946

-

-

IDEA Electronic Components Group

UK . 1,915 parts In-Stock

1+ parts

$10.910

100+ parts

$10.364

1k+ parts

$9.819

10k+ parts

-

1,915

$10.910

$10.364

$9.819

-

Microchip USA

USA . 3,456 parts In-Stock

1+ parts

$21.510

100+ parts

$21.200

1k+ parts

$21.050

10k+ parts

$20.890

3,456

$21.510

$21.200

$21.050

$20.890

A-Z Elektronik GmbH

Germany . 5,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,910

-

-

-

-

Alle Elektronik GmbH

Germany . 3,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,940

-

-

-

-

Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Technical Specifications

Analog-to-Digital Converters ADS8318IDGSR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0023 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.4 µs

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.048 V

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.375 V

Maximum Supply Current:

4.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADS8318IDGSR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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