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ADS8318IBDGSTG4

Texas Instruments

ADS8318IBDGSTG4 by Texas Instruments

Texas Instruments ADS8318IBDGSTG4 is a 16-bit ADC with 0.0015% EL, operating at 3.3V/5V. It offers 0.5 MHz sample rate, BINARY output in SERIAL format for industrial applications. Package: PLASTIC/EPOXY, SQUARE shape, GULL WING terminals with 10 pins and -40 to 85°C temp range.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 19,250 parts In-Stock

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19,250

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Vyrian

USA . 7,831 parts In-Stock

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7,831

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Digiode

USA . 3,952 parts In-Stock

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3,952

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Nova Conductors

Japan . 59 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 826 parts In-Stock

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$6.166

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826

$6.166

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Parana Technologies

USA . 2,296 parts In-Stock

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$6.986

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$7.556

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2,296

$6.986

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$7.556

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ChromeModa Solutions

Germany . 3,418 parts In-Stock

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$7.850

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$6.437

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3,418

$7.850

$6.437

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IDEA Electronic Components Group

UK . 1,361 parts In-Stock

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$7.850

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$7.065

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1,361

$7.850

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$7.065

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One Stop Electronics

USA . 1,313 parts In-Stock

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$10.000

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Corohmni

South Africa . 210 parts In-Stock

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$12.466

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210

$12.466

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Ampacity Inc.

Singapore . 374 parts In-Stock

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$16.000

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374

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Argo Parts USA

USA . 4,584 parts In-Stock

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Continental Prestige Electronics

USA . 3,672 parts In-Stock

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Microchip USA

USA . 2,047 parts In-Stock

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DigiPath Technology Company

USA . 1,759 parts In-Stock

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$7.078

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$7.078

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Corphita

USA . 744 parts In-Stock

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744

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the ADS8318IBDGSTG4 by Texas Instruments. As a leader in Analog-to-Digital Converters, Texas Instruments delivers top-notch quality and performance. This versatile product is perfect for a wide range of applications, providing customers with accurate and efficient results. With its small outline and thin profile package style, this ADC offers convenience without compromising on functionality. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Choose the ADS8318IBDGSTG4 for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 16

The 16-bit resolution allows for high precision and accuracy in converting analog signals to digital data, making it suitable for applications where precise measurements are required.

Maximum Linearity Error (EL): 0.0015 %

The low linearity error ensures that the digital output closely matches the input analog signal, providing accurate and reliable results in data conversion.

Power Supplies (V): 3.3,5

Supporting multiple power supply voltages of 3.3V and 5V makes this product versatile and compatible with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this ADC can withstand harsh environmental conditions, making it suitable for industrial applications.

Sample Rate: 0.5 MHz

The high sample rate of 0.5 MHz allows for fast and efficient conversion of analog signals to digital data, making this ADC ideal for real-time signal processing applications.

Technical Specifications

Analog-to-Digital Converters ADS8318IBDGSTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0015 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.4 µs

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.048 V

Maximum Analog Input Voltage:

5.6 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

4.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8318IBDGSTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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