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ADS803E/1KG4

Texas Instruments

ADS803E/1KG4 by Texas Instruments

Texas Instruments ADS803E/1KG4 is a 12-bit ADC with 0.0488% EL, 5 MHz sample rate, and 5V supply voltage. Ideal for industrial applications, it features a small outline package with 28 terminals and operates b/w -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,706 parts In-Stock

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5,706

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Digiode

USA . 2,515 parts In-Stock

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2,515

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Distributors (Availability)

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Native Components

USA . 131 parts In-Stock

1+ parts

$5.443

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131

$5.443

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One Stop Electronics

USA . 987 parts In-Stock

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$7.000

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987

$7.000

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AZTECH Wire

Italy . 732 parts In-Stock

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$14.840

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732

$14.840

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Parana Technologies

USA . 1,209 parts In-Stock

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$15.291

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$15.684

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1,209

$15.291

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$15.684

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ChromeModa Solutions

Germany . 3,787 parts In-Stock

1+ parts

$17.181

100+ parts

$14.088

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3,787

$17.181

$14.088

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

1+ parts

$17.181

100+ parts

$16.322

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$15.463

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1,261

$17.181

$16.322

$15.463

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Corphita

USA . 2,674 parts In-Stock

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2,674

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,862 parts In-Stock

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$5.334

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1,862

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$5.334

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$15.490

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1,110

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$15.490

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Microchip USA

USA . 391 parts In-Stock

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391

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Overview

Experience superior analog-to-digital conversion with the ADS803E/1KG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. This ADC converter offers precision and efficiency, making it ideal for industrial use. With a compact design and advanced features, the ADS803E/1KG4 provides exceptional value and performance to meet your needs. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Bits: 12

Higher number of bits allows for more precise conversion of analog signals to digital, resulting in accurate data acquisition.

Maximum Linearity Error (EL): 0.0488%

Low linearity error ensures accuracy in the conversion process, making the product reliable for various applications.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with many systems and easy to integrate into existing setups.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for use in industrial environments without risk of overheating or malfunction.

Sample Rate: 5 MHz

This high sample rate enables fast and precise conversion of analog signals, making the product suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADS803E/1KG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

5 MHz

Hold Mode:

Track

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

1.5 V

Maximum Analog Input Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS803E/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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