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ADS7825UG4

Texas Instruments

ADS7825UG4 by Texas Instruments

The Texas Instruments ADS7825UG4 is a 16-bit ADC with 4 analog in channels, 0.0046% linearity error, and 20us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,286 parts In-Stock

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Digiode

USA . 1,816 parts In-Stock

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1,816

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Distributors (Availability)

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Native Components

USA . 111 parts In-Stock

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$0.713

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111

$0.713

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Northwest PG Solutions

USA . 1,635 parts In-Stock

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$0.784

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1,635

$0.784

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Parana Technologies

USA . 1,142 parts In-Stock

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$11.289

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$11.720

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1,142

$11.289

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$11.720

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DigiPath Technology Company

USA . 673 parts In-Stock

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$12.430

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673

$12.430

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ChromeModa Solutions

Germany . 3,374 parts In-Stock

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$12.684

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$10.401

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3,374

$12.684

$10.401

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IDEA Electronic Components Group

UK . 1,712 parts In-Stock

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$12.684

100+ parts

$12.050

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$11.416

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1,712

$12.684

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$11.416

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AZTECH Wire

Italy . 891 parts In-Stock

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$17.554

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One Stop Electronics

USA . 1,211 parts In-Stock

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$24.000

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Corphita

USA . 4,920 parts In-Stock

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Microchip USA

USA . 2,184 parts In-Stock

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Overview

Elevate your analog-to-digital conversion with the Texas Instruments ADS7825UG4. Crafted with precision and expertise, this ADC delivers unparalleled performance for a variety of applications. From industrial automation to medical devices, this converter offers exceptional accuracy and reliability. With a compact design and high-speed conversion capabilities, the ADS7825UG4 is the perfect solution for your digitalization needs. Upgrade your systems today and experience the quality and value that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

No. of Analog In Channels: 4

Allows for multiple inputs to be converted simultaneously, increasing efficiency and flexibility in data acquisition.

Surface Mount: YES

Enables easy and secure installation on circuit boards, saving space and simplifying manufacturing processes.

No. of Bits: 16

Provides high resolution and accuracy in conversion, ensuring precise measurement and data acquisition.

Maximum Linearity Error (EL): 0.0046%

Ensures minimal error in the conversion process, resulting in highly accurate and reliable data output.

Power Supplies (V): 5

Operates efficiently at standard voltage levels, making it compatible with a wide range of systems and applications.

No. of Terminals: 28

Offers sufficient connectivity options for interfacing with other components, enhancing versatility in system integration.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring stable performance in demanding conditions.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes a reliable conversion method for accurate analog-to-digital signal conversion, producing high-quality digital output.

Technical Specifications

Analog-to-Digital Converters ADS7825UG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial, Parallel, 8 Bits

Maximum Linearity Error (EL):

0.0046 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.75 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.703 in (17.85 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7825UG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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