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ADS6444IRGC25

Texas Instruments

ADS6444IRGC25 by Texas Instruments

The Texas Instruments ADS6444IRGC25 is a 14-bit ADC with 4 analog input channels, operating at a sample rate of 105 MHz. It features a max linearity error of 0.0305% and supports binary, offset binary, and 2's complement output bit codes. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,808 parts In-Stock

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Digiode

USA . 1,854 parts In-Stock

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1,854

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Distributors (Availability)

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Native Components

USA . 156 parts In-Stock

1+ parts

$14.910

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156

$14.910

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AZTECH Wire

Italy . 698 parts In-Stock

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$16.377

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698

$16.377

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Northwest PG Solutions

USA . 1,225 parts In-Stock

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$16.401

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$14.761

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$16.401

$14.761

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Parana Technologies

USA . 105 parts In-Stock

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$22.697

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$23.359

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105

$22.697

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$23.359

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DigiPath Technology Company

USA . 960 parts In-Stock

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$24.992

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960

$24.992

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IDEA Electronic Components Group

UK . 1,589 parts In-Stock

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$25.502

100+ parts

$24.227

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$22.952

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1,589

$25.502

$24.227

$22.952

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ChromeModa Solutions

Germany . 716 parts In-Stock

1+ parts

$25.502

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$20.912

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716

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One Stop Electronics

USA . 1,001 parts In-Stock

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$29.000

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$29.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,042 parts In-Stock

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Microchip USA

USA . 4,797 parts In-Stock

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Corphita

USA . 2,780 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the ADS6444IRGC25 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers a top-notch solution for your conversion needs. With a compact square package body and 105 MHz sample rate, this ADC offers exceptional precision and performance. Ideal for industrial applications requiring high-speed data acquisition, this converter ensures accuracy and reliability, making it the perfect choice for your next project. Upgrade to Texas Instruments for unmatched value and results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the ADC.

No. of Analog In Channels: 4

Allows for multiple analog inputs to be converted simultaneously, increasing efficiency.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards.

No. of Bits: 14

Offers high resolution for precise analog-to-digital conversion.

Maximum Linearity Error (EL): 0.0305 %

Ensures accurate conversion of analog signals with minimal error.

Power Supplies (V): 3.3

Operates at a standard voltage level that is widely available.

No. of Terminals: 64

Provides ample connectivity options for integration into larger systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers versatility in terms of packaging options for different application requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures as well, offering versatility in use.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for reliable performance.

Terminal Position: QUAD

Enables easy connectivity and integration into circuit layouts.

Maximum Seated Height: 1 mm

Has a low profile design, ideal for space-constrained applications.

Width: 9 mm

Compact size allows for easy integration into circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during installation process.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering process for reliable connection.

Length: 9 mm

Compact size for space-efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications with varying temperature conditions.

Maximum Analog Input Voltage: 2 V

Accepts a wide range of analog input voltages for versatility in use.

Sample Rate: 105 MHz

Provides fast conversion rates for real-time processing of analog signals.

Technology: CMOS

Uses CMOS technology for low power consumption and high speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Converter Type: ADC, PROPRIETARY METHOD

Uses a proprietary conversion method for optimized performance and accuracy.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage for compatibility with various systems.

Output Bit Code: BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY

Offers multiple output formats for flexibility in data processing.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and high-density integration.

Minimum Analog Input Voltage: 0 V

Accepts zero voltage inputs for accurate conversion of low-level signals.

Output Format: SERIAL

Serial output format for efficient data transmission and processing.

Sample and Hold/Track and Hold: SAMPLE

Provides sample and hold functionality for accurate conversion of varying input signals.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for reliability in various environmental conditions.

Technical Specifications

Analog-to-Digital Converters ADS6444IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

105 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6444IRGC25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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