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ADS6443IRGCR

Texas Instruments

ADS6443IRGCR by Texas Instruments

The Texas Instruments ADS6443IRGCR is a 14-bit ADC with 4 analog input channels, operating at a sample rate of 80 MHz. It features a max linearity error of 0.0275%, suitable for industrial applications requiring precise analog-to-digital conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,397 parts In-Stock

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Vyrian

USA . 4,210 parts In-Stock

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4,210

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AZTECH Wire

Italy . 557 parts In-Stock

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$7.373

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557

$7.373

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Native Components

USA . 993 parts In-Stock

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$9.240

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993

$9.240

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Northwest PG Solutions

USA . 286 parts In-Stock

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$10.164

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$9.148

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286

$10.164

$9.148

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One Stop Electronics

USA . 1,600 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 509 parts In-Stock

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$20.568

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$20.659

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509

$20.568

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$20.659

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ChromeModa Solutions

Germany . 1,521 parts In-Stock

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$23.110

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$18.950

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$23.110

$18.950

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IDEA Electronic Components Group

UK . 1,098 parts In-Stock

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$23.110

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$21.954

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$20.799

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1,098

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$21.954

$20.799

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A-Z Elektronik GmbH

Germany . 7,277 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,851 parts In-Stock

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Microchip USA

USA . 1,127 parts In-Stock

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Corphita

USA . 515 parts In-Stock

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DigiPath Technology Company

USA . 483 parts In-Stock

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$20.836

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$20.836

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Overview

Elevate your analog-to-digital conversion experience with the ADS6443IRGCR by Texas Instruments, a cutting-edge solution that embodies quality and innovation. Crafted with precision and expertise by a renowned manufacturer, this ADC offers unparalleled performance in a variety of applications. With its advanced technology and high-speed sample rate of 80 MHz, this converter delivers accurate results efficiently. Unlock the full potential of your designs and projects with the ADS6443IRGCR, where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to environmental factors, making this product reliable for various applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for more versatile and complex measurements to be taken simultaneously or in sequence.

Package Shape: SQUARE

Square package shape provides a compact design, saving space and making this product suitable for applications where size constraints are important.

No. of Bits: 14

With 14 bits resolution, this ADC can provide accurate and precise conversion of analog signals into digital data.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can function effectively in industrial environments with elevated temperatures.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance, making this product energy-efficient and suitable for fast data conversion.

Sample Rate: 80 MHz

A high sample rate of 80 MHz enables this ADC to capture fast-changing analog signals accurately, making it ideal for applications requiring real-time data processing.

Technical Specifications

Analog-to-Digital Converters ADS6443IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0275 %

Sample Rate:

80 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6443IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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