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ADS6425IRGCR

Texas Instruments

ADS6425IRGCR by Texas Instruments

ADS6425IRGCR by Texas Instruments is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 125 MHz. It features a max linearity error of 0.061%, suitable for industrial applications requiring precise analog-to-digital conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,819 parts In-Stock

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Digiode

USA . 2,619 parts In-Stock

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2,619

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Native Components

USA . 706 parts In-Stock

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$5.365

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706

$5.365

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One Stop Electronics

USA . 1,515 parts In-Stock

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$14.000

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$14.000

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AZTECH Wire

Italy . 624 parts In-Stock

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$17.121

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624

$17.121

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Parana Technologies

USA . 2,023 parts In-Stock

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$22.699

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$23.363

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$22.699

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DigiPath Technology Company

USA . 1,153 parts In-Stock

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$24.994

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$24.994

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ChromeModa Solutions

Germany . 4,815 parts In-Stock

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$25.504

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$20.913

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$25.504

$20.913

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IDEA Electronic Components Group

UK . 2,337 parts In-Stock

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$25.504

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$24.229

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$22.954

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$22.954

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A-Z Elektronik GmbH

Germany . 7,101 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,734 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Northwest PG Solutions

USA . 1,869 parts In-Stock

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Corphita

USA . 441 parts In-Stock

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Microchip USA

USA . 258 parts In-Stock

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Overview

Unlock the power of precision with the ADS6425IRGCR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that are versatile and reliable. With 4 analog input channels and a sample rate of 125 MHz, this chip carrier converter offers unmatched accuracy and performance for industrial applications. Experience the benefits of its 12-bit resolution and offset binary output format, providing customers with valuable insights and high-quality results. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components, making the product suitable for a variety of environments.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile input options and enables the device to handle multiple inputs simultaneously.

Surface Mount: YES

Surface mount capability makes installation and integration easier, especially in compact electronic designs.

No. of Bits: 12

With a 12-bit resolution, this ADC can provide higher precision in converting analog signals to digital, resulting in more accurate data acquisition.

Maximum Linearity Error (EL): 0.061 %

The low linearity error ensures that the output values closely match the input signals, improving the overall accuracy of the conversion process.

Technical Specifications

Analog-to-Digital Converters ADS6425IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6425IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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