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ADS62P28IRGC25

Texas Instruments

ADS62P28IRGC25 by Texas Instruments

Texas Instruments ADS62P28IRGC25 is a 12-bit ADC with 2 analog in channels, operating at a sample rate of 210 MHz. It features a max linearity error of 0.1221% and supports power supplies of 1.8V and 3.3V. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,945 parts In-Stock

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2,945

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Digiode

USA . 460 parts In-Stock

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460

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Distributors (Availability)

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Northwest PG Solutions

USA . 130 parts In-Stock

1+ parts

$3.014

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130

$3.014

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AZTECH Wire

Italy . 680 parts In-Stock

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$12.820

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680

$12.820

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Parana Technologies

USA . 1,547 parts In-Stock

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$15.935

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$16.289

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1,547

$15.935

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$16.289

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DigiPath Technology Company

USA . 1,478 parts In-Stock

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$17.547

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1,478

$17.547

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ChromeModa Solutions

Germany . 5,434 parts In-Stock

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$17.905

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$14.682

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5,434

$17.905

$14.682

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IDEA Electronic Components Group

UK . 1,598 parts In-Stock

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$17.905

100+ parts

$17.010

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$16.114

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1,598

$17.905

$17.010

$16.114

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One Stop Electronics

USA . 1,357 parts In-Stock

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$26.000

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1,357

$26.000

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Corphita

USA . 3,004 parts In-Stock

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Microchip USA

USA . 2,460 parts In-Stock

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2,460

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Native Components

USA . 287 parts In-Stock

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$2.658

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287

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$2.658

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Overview

Unlock the power of high-quality analog-to-digital conversion with the ADS62P28IRGC25 by Texas Instruments. Known for their top-notch manufacturing, Texas Instruments delivers a reliable product that exceeds expectations. This ADC is perfect for various applications, offering customers unmatched value and benefits. With its advanced technology and industrial-grade components, this converter provides accurate and efficient performance. Experience seamless integration and exceptional results with the ADS62P28IRGC25.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the analog-to-digital converter.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in the input sources that can be connected to the converter, making it versatile for different applications.

No. of Bits: 12

With 12 bits of resolution, this analog-to-digital converter can provide high accuracy in converting analog signals into digital data.

Power Supplies (V): 1.8,3.3

The availability of power supplies at 1.8V and 3.3V allows for compatibility with various systems and makes it easy to integrate this converter into existing setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that this converter can perform reliably in a wide range of environmental conditions.

Sample Rate: 210 MHz

The high sample rate of 210 MHz enables fast and accurate conversion of analog signals, making this converter suitable for applications requiring real-time data processing.

Technology: CMOS

The CMOS technology used in this converter offers low power consumption and high noise immunity, making it efficient and reliable for various electronic systems.

Technical Specifications

Analog-to-Digital Converters ADS62P28IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1221 %

Sample Rate:

210 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS62P28IRGC25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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