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ADS62P24IRGC25

Texas Instruments

ADS62P24IRGC25 by Texas Instruments

The Texas Instruments ADS62P24IRGC25 is a 12-bit ADC with 2 analog input channels, operating at a sample rate of 105 MHz. It has a max linearity error of 0.0488% and supports binary, offset binary, and 2's complement output bit codes. Ideal for industrial applications requiring high-speed data conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,479 parts In-Stock

1+ parts

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8,479

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Digiode

USA . 2,066 parts In-Stock

1+ parts

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2,066

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 894 parts In-Stock

1+ parts

$1.560

100+ parts

-

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894

$1.560

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Northwest PG Solutions

USA . 1,426 parts In-Stock

1+ parts

$1.716

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-

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1,426

$1.716

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AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$12.047

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602

$12.047

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Parana Technologies

USA . 1,244 parts In-Stock

1+ parts

$18.423

100+ parts

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$18.546

10k+ parts

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1,244

$18.423

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$18.546

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DigiPath Technology Company

USA . 862 parts In-Stock

1+ parts

$20.286

100+ parts

$18.663

1k+ parts

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10k+ parts

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862

$20.286

$18.663

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ChromeModa Solutions

Germany . 3,247 parts In-Stock

1+ parts

$20.700

100+ parts

$16.974

1k+ parts

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3,247

$20.700

$16.974

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IDEA Electronic Components Group

UK . 1,226 parts In-Stock

1+ parts

$20.700

100+ parts

$19.665

1k+ parts

$18.630

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1,226

$20.700

$19.665

$18.630

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One Stop Electronics

USA . 502 parts In-Stock

1+ parts

$30.000

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502

$30.000

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Microchip USA

USA . 2,682 parts In-Stock

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2,682

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Corphita

USA . 2,667 parts In-Stock

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2,667

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Overview

Experience unparalleled precision and performance with the Texas Instruments ADS62P24IRGC25 Analog-to-Digital Converter. Known for their cutting-edge technology and reliability, Texas Instruments delivers a product that exceeds expectations. Ideal for industrial applications, this converter boasts a high sample rate of 105 MHz and a maximum linearity error of just 0.0488%, ensuring accurate and efficient data conversion. Upgrade your system with the ADS62P24IRGC25 and discover the value of superior quality and performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for a variety of applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more versatile input options, making the product suitable for dual-channel signal processing.

Surface Mount: YES

Being surface-mountable simplifies the installation process and saves space on the PCB.

No. of Bits: 12

With 12 bits of resolution, the ADC can provide more accurate and detailed digital representation of the analog input signals.

Maximum Linearity Error (EL): 0.0488%

The low linearity error ensures accurate conversion of analog signals into digital format, making it reliable for critical applications.

Power Supplies (V): 1.8/3.3,3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 64

Having 64 terminals allows for easy connection and integration into complex circuits, enabling versatile signal processing capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer options for thermal management, space constraints, and overall system design requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function smoothly in cold temperatures without any performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, extending the product's lifespan.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and enhances the overall ease of use of the product.

Maximum Seated Height: 1 mm

Having a low maximum seated height makes the product suitable for applications with space constraints, allowing for compact designs.

Width: 9 mm

The narrow width of 9mm enables easy placement on the PCB and efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the product can undergo reflow soldering without any issues, ensuring proper solder connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable soldering during the manufacturing process.

Length: 9 mm

The compact length of 9mm allows for easy integration into tight spaces or small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand a wide temperature range, making it suitable for industrial applications.

Maximum Analog Input Voltage: 2 V

Support for up to 2V analog input voltage allows for compatibility with a wide range of analog signal levels, offering versatile signal processing capabilities.

Sample Rate: 105 MHz

The high sample rate of 105 MHz enables fast and efficient conversion of analog signals into digital data, making it suitable for high-speed applications.

Technology: CMOS

Being based on CMOS technology offers low power consumption, high integration, and compatibility with a wide range of applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and reduces the risk of solder joint failure, ensuring reliability in operation.

Converter Type: ADC, PROPRIETARY METHOD

The use of a proprietary ADC conversion method ensures optimized performance and accuracy, making the product stand out in terms of conversion quality.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides compatibility with standard power supply levels, making it easy to integrate into various systems.

Output Bit Code: BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple output bit codes offers flexibility in data representation, compatibility with different systems, and ease of integration.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and efficient use of PCB space, ideal for compact designs.

Minimum Analog Input Voltage: -2 V

Support for a minimum analog input voltage of -2V offers compatibility with a wide range of signal levels, allowing for versatile signal processing capabilities.

Output Format: PARALLEL, WORD

Support for parallel and word output formats offers flexibility in data transmission and compatibility with different systems and interfaces.

Sample and Hold/Track and Hold: SAMPLE

Having sample and hold functionality simplifies the signal processing process, ensuring accurate capture and conversion of analog signals into digital data.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate levels of moisture exposure during storage and handling, ensuring reliability in various environments.

Technical Specifications

Analog-to-Digital Converters ADS62P24IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

105 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8/3.3,3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS62P24IRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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