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ADS61B29IRGZT

Texas Instruments

ADS61B29IRGZT by Texas Instruments

Texas Instruments' ADS61B29IRGZT is a 12-bit ADC with 250 MHz sample rate, 0.061% linearity error, and 2V max analog input voltage. Ideal for industrial applications, it operates b/w -40 to 85°C, in a compact square package with 48 terminals for surface mounting.

Median Price

$93.296

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$16.550

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1

$16.550

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Chip1Stop

Japan . 1 parts In-Stock

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$82.700

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1

$82.700

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Texas Instruments

USA . 2,714 parts In-Stock

1+ parts

$93.296

100+ parts

$90.490

1k+ parts

$70.147

10k+ parts

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2,714

$93.296

$90.490

$70.147

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Rochester

USA . 733 parts In-Stock

1+ parts

-

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$100.460

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$89.890

10k+ parts

$84.600

733

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$100.460

$89.890

$84.600

DigiKey

USA . 733 parts In-Stock

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Verical

USA . 250 parts In-Stock

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$125.575

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$112.362

10k+ parts

$105.750

250

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$125.575

$112.362

$105.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 945 parts In-Stock

1+ parts

$15.722

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945

$15.722

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Vyrian

USA . 4,928 parts In-Stock

1+ parts

$16.550

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4,928

$16.550

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DigiKey Marketplace

USA . 748 parts In-Stock

1+ parts

$101.330

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748

$101.330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

$11.190

100+ parts

-

1k+ parts

$11.633

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1,645

$11.190

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$11.633

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DigiPath Technology Company

USA . 1,271 parts In-Stock

1+ parts

$12.322

100+ parts

$11.336

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1,271

$12.322

$11.336

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ChromeModa Solutions

Germany . 3,130 parts In-Stock

1+ parts

$12.573

100+ parts

$10.310

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$12.573

$10.310

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IDEA Electronic Components Group

UK . 314 parts In-Stock

1+ parts

$12.573

100+ parts

$11.944

1k+ parts

$11.316

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314

$12.573

$11.944

$11.316

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Corphita

USA . 924 parts In-Stock

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$14.895

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$14.895

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Vigor

Singapore . 748 parts In-Stock

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$94.380

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748

$94.380

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Authorized Procurement Solutions

USA . 3,200 parts In-Stock

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Perfect Parts

USA . 2,717 parts In-Stock

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Native Components

USA . 769 parts In-Stock

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769

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Northwest PG Solutions

USA . 135 parts In-Stock

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Kepictronics

USA . 129 parts In-Stock

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Overview

Unlock unparalleled precision and performance with the Texas Instruments ADS61B29IRGZT Analog-to-Digital Converter. Crafted by a renowned manufacturer, this cutting-edge device offers exceptional quality and reliability. Ideal for a wide range of applications, this ADC ensures accurate conversions with minimal error. Experience seamless integration and superior functionality with this advanced converter, providing unmatched value and benefits to customers seeking top-tier performance in their designs. Elevate your projects with the ADS61B29IRGZT and achieve unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during the manufacturing process.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide accurate conversion of analog signals into digital data, making it suitable for high-precision applications.

Maximum Linearity Error (EL): 0.061%

The low linearity error ensures that the output data closely matches the input signal, leading to reliable and consistent performance.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows flexibility in the design and integration of the ADC into different systems.

No. of Terminals: 48

The high number of terminals provides ample connectivity options, enabling versatile interfacing with external components and circuits.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows the ADC to function reliably in various environmental conditions, enhancing its usability in diverse applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures the ADC's performance even in extreme cold environments, increasing its reliability and suitability for harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers good conductivity and corrosion resistance, ensuring long-term reliability and signal integrity in the ADC's connections.

Technology: CMOS

CMOS technology provides low power consumption and high integration capabilities, making the ADC energy-efficient and compact for space-constrained applications.

Minimum Analog Input Voltage: -2 V

Support for negative analog input voltages allows the ADC to handle a wider range of signals, expanding its compatibility with various signal sources.

Sample Rate: 250 MHz

The high sample rate enables fast and accurate conversion of analog signals, making the ADC suitable for high-speed data acquisition and processing tasks.

Technical Specifications

Analog-to-Digital Converters ADS61B29IRGZT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS61B29IRGZT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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