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ADS6128IRGZ25

Texas Instruments

ADS6128IRGZ25 by Texas Instruments

ADS6128IRGZ25 by Texas Instruments is a 12-bit ADC with 210 MHz sample rate, 0.061% linearity error, and 2 V max analog input voltage. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,440 parts In-Stock

1+ parts

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3,440

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Digiode

USA . 1,810 parts In-Stock

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1,810

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Distributors (Availability)

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Parana Technologies

USA . 2,144 parts In-Stock

1+ parts

$5.280

100+ parts

-

1k+ parts

$5.906

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2,144

$5.280

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$5.906

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DigiPath Technology Company

USA . 1,668 parts In-Stock

1+ parts

$5.814

100+ parts

$5.349

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-

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1,668

$5.814

$5.349

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ChromeModa Solutions

Germany . 3,616 parts In-Stock

1+ parts

$5.933

100+ parts

$4.865

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3,616

$5.933

$4.865

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IDEA Electronic Components Group

UK . 698 parts In-Stock

1+ parts

$5.933

100+ parts

-

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$5.340

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698

$5.933

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$5.340

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AZTECH Wire

Italy . 233 parts In-Stock

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$7.618

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233

$7.618

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One Stop Electronics

USA . 232 parts In-Stock

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$22.000

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232

$22.000

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Native Components

USA . 280 parts In-Stock

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$48.561

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$46.618

280

$48.561

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$46.618

Northwest PG Solutions

USA . 1,586 parts In-Stock

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$53.417

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1,586

$53.417

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Microchip USA

USA . 2,378 parts In-Stock

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2,378

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Corphita

USA . 1,170 parts In-Stock

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Overview

Unlock precision and efficiency with the ADS6128IRGZ25 by Texas Instruments, a cutting-edge Analog-to-Digital Converter that guarantees top-notch quality and reliability. Ideal for a wide range of industrial applications, this product offers unparalleled performance and accuracy, backed by the trusted reputation of its manufacturer. Experience seamless integration and enhanced functionality with this advanced solution, designed to exceed your expectations and deliver unmatched value to customers seeking superior results. Elevate your projects to new heights with the ADS6128IRGZ25 and revolutionize your technological endeavors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the internal components of the converter, making it suitable for various rugged industrial applications.

No. of Bits: 12

With 12 bits of resolution, this converter offers high precision in converting analog signals to digital, ensuring accurate and detailed data acquisition.

Power Supplies (V): 1.8,3.3

The availability of multiple power supply options (1.8V and 3.3V) allows for flexibility in system design and integration, catering to different voltage requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, making it suitable for industrial settings.

Sample Rate: 210 MHz

With a high sample rate of 210 MHz, this converter can capture and process data rapidly, suitable for applications requiring real-time signal conversion and analysis.

Technical Specifications

Analog-to-Digital Converters ADS6128IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

210 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6128IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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