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ADS1112IDRCTG4

Texas Instruments

ADS1112IDRCTG4 by Texas Instruments

ADS1112IDRCTG4 by Texas Instruments is a 16-bit ADC with 4 analog in channels, 0.01% linearity error, and 5V power supply. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C. Package style: small outline, heat sink/slug, very thin profile.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,054 parts In-Stock

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Chip Stock

USA . 6,200 parts In-Stock

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VNN

France . 2,703 parts In-Stock

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Digiode

USA . 710 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 889 parts In-Stock

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$17.016

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889

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Parana Technologies

USA . 1,413 parts In-Stock

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$19.202

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$19.244

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DigiPath Technology Company

USA . 2,230 parts In-Stock

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$21.144

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$19.452

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$21.144

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ChromeModa Solutions

Germany . 6,785 parts In-Stock

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$21.575

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$17.692

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IDEA Electronic Components Group

UK . 797 parts In-Stock

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$21.575

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$20.496

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$19.418

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797

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Ampacity Inc.

Singapore . 743 parts In-Stock

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One Stop Electronics

USA . 1,569 parts In-Stock

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$25.000

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Corphita

USA . 1,768 parts In-Stock

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Microchip USA

USA . 1,756 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unlock precision in data conversion with the ADS1112IDRCTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that promise reliability and accuracy. With 4 analog input channels and a compact square package shape, this converter is ideal for a wide range of applications. Whether you're working in industrial settings or developing consumer electronics, this product offers superior performance, low power consumption, and excellent linearity error to meet your needs. Trust Texas Instruments for cutting-edge technology that enhances your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications while keeping the overall weight low.

No. of Analog In Channels: 4

Having 4 analog input channels allows for greater flexibility in input connections and the ability to process multiple analog signals simultaneously.

Surface Mount: YES

Surface mount technology simplifies the assembly process and reduces the overall size of the product, making it ideal for compact designs.

No. of Bits: 16

With 16 bits, this ADC can provide high-resolution conversions, resulting in accurate and precise digital representations of analog signals.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes integration into existing systems seamless and convenient.

Output Bit Code: 2'S COMPLEMENT BINARY

The 2's complement binary output format is widely used and easily interpretable by digital systems, enhancing compatibility and usability.

Technical Specifications

Analog-to-Digital Converters ADS1112IDRCTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Other Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.01 %

Sample Rate:

308 Hz

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-200 mV

Maximum Analog Input Voltage:

5.7 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

350 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

SOLCC10,.11,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N10

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS1112IDRCTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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