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ADC12032CIWM

Texas Instruments

ADC12032CIWM by Texas Instruments

ADC12032CIWM by Texas Instruments is a 12-bit ADC with 8 analog in channels, 5 MHz sample rate, and 0.0244% max linearity error. It is used in industrial applications for precise analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,127 parts In-Stock

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Digiode

USA . 1,660 parts In-Stock

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1,660

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Anansix

USA . 435 parts In-Stock

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435

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Native Components

USA . 107 parts In-Stock

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$0.912

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107

$0.912

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Northwest PG Solutions

USA . 2,108 parts In-Stock

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$1.003

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$1.003

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AZTECH Wire

Italy . 3,393 parts In-Stock

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$2.910

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$2.790

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$2.740

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$2.680

3,393

$2.910

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$2.680

Parana Technologies

USA . 176 parts In-Stock

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$14.738

100+ parts

$1,368.684

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$13.265

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176

$14.738

$1,368.684

$13.265

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DigiPath Technology Company

USA . 2,350 parts In-Stock

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$16.229

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$16.229

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ChromeModa Solutions

Germany . 560 parts In-Stock

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$16.560

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$13.579

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560

$16.560

$13.579

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IDEA Electronic Components Group

UK . 215 parts In-Stock

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$16.560

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$15.732

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$14.904

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215

$16.560

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$14.904

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One Stop Electronics

USA . 1,210 parts In-Stock

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$38.000

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Corphita

USA . 3,816 parts In-Stock

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Assy Fe

Spain . 16 parts In-Stock

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Overview

Experience unparalleled precision and performance with the Texas Instruments ADC12032CIWM Analog-to-Digital Converter. Crafted with expertise by a trusted manufacturer, this cutting-edge device offers 12 bits of accuracy across 8 channels, making it ideal for a wide range of industrial applications. From its small outline package to its quick conversion time, this converter delivers unmatched value and reliability. Elevate your projects with the ADC12032CIWM and unlock a world of possibilities in data acquisition and signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and durable, ideal for portable or rugged applications.

No. of Analog In Channels: 8

With 8 analog input channels, this product can handle multiple input signals simultaneously, providing flexibility in data acquisition.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost during production.

No. of Bits: 12

The 12-bit resolution ensures high precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error of 0.0244% ensures minimal distortion in the conversion process, resulting in accurate output data.

No. of Terminals: 16

With 16 terminals, this product offers sufficient connectivity options for interfacing with other devices or components in a system.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of -40 to 85°C makes this product suitable for industrial applications in varying environmental conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this product can be easily integrated into existing systems without the need for additional power source.

Sample Rate: 5 MHz

With a high sample rate of 5 MHz, this product can capture fast-changing input signals accurately, making it suitable for real-time data acquisition.

Technical Specifications

Analog-to-Digital Converters ADC12032CIWM attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

12

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

5 MHz

Hold Mode:

Sample

Maximum Conversion Time:

8.8 µs

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.493 mm)

Length:

0.504 in (12.8015 mm)

Maximum Seated Height:

0.104 in (2.642 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Trade Compliance

ADC12032CIWM Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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