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78P300-IH

Texas Instruments

78P300-IH by Texas Instruments

Texas Instruments' 78P300-IH is a PCM transceiver telecom IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include J bend terminal form, 5V supply voltage, and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,558 parts In-Stock

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Digiode

USA . 3,783 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 432 parts In-Stock

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$7.045

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432

$7.045

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Parana Technologies

USA . 618 parts In-Stock

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$11.623

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$1,079.326

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$10.460

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618

$11.623

$1,079.326

$10.460

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DigiPath Technology Company

USA . 2,357 parts In-Stock

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$12.798

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$12.798

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ChromeModa Solutions

Germany . 2,091 parts In-Stock

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$13.059

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$10.708

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2,091

$13.059

$10.708

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IDEA Electronic Components Group

UK . 1,981 parts In-Stock

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$13.059

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$12.406

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$11.753

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1,981

$13.059

$12.406

$11.753

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One Stop Electronics

USA . 1,208 parts In-Stock

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$424.000

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Northwest PG Solutions

USA . 1,308 parts In-Stock

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Corphita

USA . 1,306 parts In-Stock

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Native Components

USA . 863 parts In-Stock

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863

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Overview

Experience seamless digital transmission interfaces with the 78P300-IH by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for various applications in the telecom industry. This PCM transceiver offers unparalleled value, providing customers with a wide range of benefits and advantages. Upgrade your communication systems with the 78P300-IH and enjoy enhanced performance, efficiency, and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making this product suitable for long-term use in various conditions.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly, reducing installation time and costs.

Package Shape: SQUARE

The square shape makes the product compact and easy to integrate into existing systems or circuits.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and flexibility in design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold temperatures without compromising performance.

Terminal Position: QUAD

The quad terminal position provides secure connections and efficient signal transmission.

Maximum Seated Height: 4.572 mm

The low seated height allows for compact and space-saving designs.

Width: 11.5062 mm

The product's width is optimized for easy integration and fit in various applications.

Length: 11.5062 mm

The length of the product is suitable for efficient placement and connection within systems.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Telecom IC Type: PCM TRANSCEIVER

The PCM transceiver type is specifically designed for reliable and efficient digital transmission in telecommunications applications.

Nominal Supply Voltage: 5 V

The 5V supply voltage is common and easily accessible, ensuring compatibility with a wide range of systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides efficient signal routing and connectivity options for optimized performance.

Technical Specifications

Digital Transmission Interfaces 78P300-IH attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

78P300-IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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