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TNETS2050FNR

Texas Instruments

TNETS2050FNR by Texas Instruments

TNETS2050FNR by Texas Instruments is a PCM transceiver chip carrier with 44 terminals, operating b/w -40 to 85°C. It has a terminal pitch of 1.27mm and nominal voltage of 5V, suitable for digital transmission interfaces in industrial telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,171 parts In-Stock

1+ parts

-

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2,171

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Digiode

USA . 1,429 parts In-Stock

1+ parts

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1,429

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 870 parts In-Stock

1+ parts

$6.554

100+ parts

-

1k+ parts

$7.296

10k+ parts

-

870

$6.554

-

$7.296

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DigiPath Technology Company

USA . 2,018 parts In-Stock

1+ parts

$7.217

100+ parts

$6.639

1k+ parts

-

10k+ parts

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2,018

$7.217

$6.639

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ChromeModa Solutions

Germany . 4,673 parts In-Stock

1+ parts

$7.364

100+ parts

$6.038

1k+ parts

-

10k+ parts

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4,673

$7.364

$6.038

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IDEA Electronic Components Group

UK . 1,537 parts In-Stock

1+ parts

$7.364

100+ parts

-

1k+ parts

$6.628

10k+ parts

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1,537

$7.364

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$6.628

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AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$12.624

100+ parts

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533

$12.624

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One Stop Electronics

USA . 1,433 parts In-Stock

1+ parts

$249.000

100+ parts

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1,433

$249.000

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Corphita

USA . 2,187 parts In-Stock

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2,187

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Overview

Upgrade your digital transmission interfaces with the TNETS2050FNR by Texas Instruments. With industry-leading quality and reliability, Texas Instruments delivers cutting-edge technology for seamless data transmission. This PCM transceiver offers unparalleled performance and versatility, making it ideal for a wide range of applications. Trust Texas Instruments to provide innovative solutions that exceed your expectations. Elevate your communication systems with the TNETS2050FNR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and facilitating mass production.

Package Shape: SQUARE

The square shape of the package is efficient in terms of PCB layout and can maximize space utilization.

No. of Terminals: 44

The high number of terminals provides ample connectivity options and flexibility for various interface configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and allows for efficient heat dissipation, ensuring reliability in operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables operation in extreme cold conditions, enhancing versatility.

Terminal Position: QUAD

The quad terminal position enhances signal integrity and ease of connection during installation and maintenance.

Maximum Seated Height: 4.57 mm

The compact maximum seated height allows for slim and streamlined device designs, optimizing space utilization.

Width: 16.5862 mm

The standard width facilitates compatibility and integration with existing systems and equipment.

Length: 16.5862 mm

The standard length ensures easy fitment and alignment within electronic assemblies, simplifying installation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness and reliability for operation in harsh industrial environments.

Terminal Form: J BEND

The J bend terminal form ensures secure and reliable electrical connections, reducing the risk of signal loss or disruptions.

Telecom IC Type: PCM TRANSCEIVER

The PCM transceiver type is optimized for efficient and reliable data transmission in telecommunications applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is standard and widely compatible with many electronic systems, simplifying integration.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density packaging and facilitates miniaturization of devices, ideal for space-constrained applications.

Technical Specifications

Digital Transmission Interfaces TNETS2050FNR attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

TNETS2050FNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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