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TNETS2050FN

Texas Instruments

TNETS2050FN by Texas Instruments

TNETS2050FN by Texas Instruments is a PCM transceiver IC with 44 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 5V, it's ideal for digital transmission interfaces requiring high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,094 parts In-Stock

1+ parts

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100+ parts

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6,094

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Digiode

USA . 84 parts In-Stock

1+ parts

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84

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$8.617

100+ parts

-

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410

$8.617

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Parana Technologies

USA . 645 parts In-Stock

1+ parts

$12.587

100+ parts

-

1k+ parts

$13.042

10k+ parts

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645

$12.587

-

$13.042

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ChromeModa Solutions

Germany . 1,949 parts In-Stock

1+ parts

$14.143

100+ parts

$11.597

1k+ parts

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1,949

$14.143

$11.597

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$14.143

100+ parts

$13.436

1k+ parts

$12.729

10k+ parts

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1,546

$14.143

$13.436

$12.729

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One Stop Electronics

USA . 1,361 parts In-Stock

1+ parts

$998.000

100+ parts

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1,361

$998.000

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Corphita

USA . 707 parts In-Stock

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707

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DigiPath Technology Company

USA . 322 parts In-Stock

1+ parts

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100+ parts

$12.751

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322

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$12.751

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Overview

Elevate your digital transmission experience with the TNETS2050FN by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers cutting-edge solutions for various applications in the digital transmission interfaces category. This innovative PCM transceiver boasts a nominal supply voltage of 5V and operates at temperatures ranging from -40 to 85°C, making it ideal for industrial settings. With 44 terminals and a compact chip carrier package style, the TNETS2050FN offers unmatched reliability and performance. Upgrade your communication systems today with this advanced solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape offers a compact design, making it ideal for applications where space is limited.

No. of Terminals: 44

Having 44 terminals provides flexibility in connectivity options and allows for complex data transmission capabilities.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is known for its reliability and thermal performance, ensuring consistent operation in demanding industrial environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function effectively in extreme cold environments.

Terminal Position: QUAD

The quad terminal position enables efficient signal transmission and connection stability, making it suitable for high-speed data transfer applications.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a slim profile and space-saving installation in compact electronic devices.

Width: 16.5862 mm

The moderate width of the product provides a balance between compactness and ease of handling during installation and maintenance.

Length: 16.5862 mm

The compact length of the product makes it suitable for space-constrained applications without compromising functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments with varying temperature conditions.

Terminal Form: J BEND

The J bend terminal form offers secure and stable connections, enhancing signal integrity and reducing the risk of signal loss during data transmission.

Telecom IC Type: PCM TRANSCEIVER

Being a PCM transceiver type telecom IC, the product enables reliable and efficient digital data transmission over long distances, making it ideal for telecommunications applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage requirement ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting, enabling more terminals to be packed in a limited space, essential for complex data transmission applications.

Technical Specifications

Digital Transmission Interfaces TNETS2050FN attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

TNETS2050FN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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