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77030012X

Texas Instruments

77030012X by Texas Instruments

The Texas Instruments 77030012X is a digital arithmetic circuit with 20 terminals, operating at -55 to 125°C. It has a supply voltage of 5V and is MILITARY grade TTL technology. This chip carrier package is ceramic, surface mountable, and suitable for military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,117 parts In-Stock

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3,117

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Digiode

USA . 188 parts In-Stock

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188

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Distributors (Availability)

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Native Components

USA . 860 parts In-Stock

1+ parts

$0.183

100+ parts

-

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$0.176

860

$0.183

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$0.176

Northwest PG Solutions

USA . 2,257 parts In-Stock

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$0.201

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-

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$0.178

2,257

$0.201

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$0.178

Andel Nordic

Denmark . 1,830 parts In-Stock

1+ parts

$6.832

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-

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$6.559

10k+ parts

$6.559

1,830

$6.832

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$6.559

$6.559

AZTECH Wire

Italy . 758 parts In-Stock

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$6.837

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758

$6.837

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Parana Technologies

USA . 621 parts In-Stock

1+ parts

$9.915

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$10.483

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621

$9.915

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$10.483

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DigiPath Technology Company

USA . 2,331 parts In-Stock

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$10.917

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2,331

$10.917

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ChromeModa Solutions

Germany . 4,691 parts In-Stock

1+ parts

$11.140

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$9.135

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$11.140

$9.135

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IDEA Electronic Components Group

UK . 207 parts In-Stock

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$11.140

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$10.583

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$10.026

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207

$11.140

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$10.026

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One Stop Electronics

USA . 1,106 parts In-Stock

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$21.000

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1,106

$21.000

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Corphita

USA . 1,493 parts In-Stock

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Overview

Discover the unparalleled quality and precision of the 77030012X by Texas Instruments, a leading manufacturer in digital arithmetic circuits. Ideal for military-grade applications, this product offers unmatched reliability and performance. With a nominal supply voltage of 5V and a temperature range from -55°C to 125°C, the 77030012X is perfect for demanding environments. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs with excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and durability, making it suitable for applications that require strong resistance to high temperatures and mechanical stress.

Surface Mount: YES

Surface mount technology makes installation easier and more cost-effective, as it allows for automated assembly and smaller form factor.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures reliability and performance consistency, which is crucial for mission-critical military applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides compatibility with other standard TTL devices, simplifying integration into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the device to function reliably in harsh environments without overheating.

Technical Specifications

Digital Arithmetic Circuits 77030012X attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

77030012X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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