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74SSTL16837ADGGRE4

Texas Instruments

74SSTL16837ADGGRE4 by Texas Instruments

74SSTL16837ADGGRE4 by Texas Instruments is a 20-bit bus driver with a propagation delay of 4.2 ns at 3.3V, suitable for commercial applications. It features a small outline package with dual terminals and Gull Wing form factor, operating b/w 0 to 70°C temperature range. With a max power supply current of 90mA, it offers TRUE output polarity and ENABLE LOW control type for efficient signal transmission in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,469 parts In-Stock

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4,469

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Digiode

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Andel Nordic

Denmark . 845 parts In-Stock

1+ parts

$3.916

100+ parts

-

1k+ parts

$3.760

10k+ parts

$3.760

845

$3.916

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$3.760

$3.760

One Stop Electronics

USA . 227 parts In-Stock

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$5.000

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227

$5.000

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AZTECH Wire

Italy . 806 parts In-Stock

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$15.732

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806

$15.732

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Parana Technologies

USA . 957 parts In-Stock

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$28.483

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$48.039

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957

$28.483

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$48.039

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DigiPath Technology Company

USA . 2,232 parts In-Stock

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$31.363

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2,232

$31.363

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ChromeModa Solutions

Germany . 4,784 parts In-Stock

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$32.003

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$26.242

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4,784

$32.003

$26.242

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$32.003

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$30.403

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$28.803

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732

$32.003

$30.403

$28.803

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Northwest PG Solutions

USA . 1,180 parts In-Stock

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1,180

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Corphita

USA . 1,123 parts In-Stock

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1,123

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Native Components

USA . 460 parts In-Stock

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460

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Microchip USA

USA . 161 parts In-Stock

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161

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Overview

Enhance the efficiency and reliability of your electronic systems with the 74SSTL16837ADGGRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Bus Drivers & Transceivers for a wide range of applications. With a nominal supply voltage of 3.3V and a propagation delay of just 4.2ns, this product offers unparalleled performance and precision. Experience seamless communication and optimal signal transmission with this advanced technology. Upgrade your projects today with the innovative solutions provided by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates on a common supply voltage, making it compatible with standard power sources.

Output Characteristics: 3-STATE

Three-state outputs provide flexibility and ease of interfacing with other components.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Maximum Operating Temperature: 70 °C

Can operate reliably in a wide range of temperature conditions, suitable for various environments.

Technical Specifications

Bus Driver & Transceivers 74SSTL16837ADGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

SSTL

JESD-30 Code:

R-PDSO-G64

Length:

17 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

20

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

3.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

74SSTL16837ADGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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