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74LVTH162245DLRG4

Texas Instruments

74LVTH162245DLRG4 by Texas Instruments

74LVTH162245DLRG4 by Texas Instruments is a bus driver & transceiver with 8 bits, 2 functions, and 3.3V nominal voltage. It features a propagation delay of 4ns, operates in industrial temperature range (-40 to 85°C), and has a max power supply current of 5mA. Ideal for bidirectional applications requiring fast signal transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,058 parts In-Stock

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Digiode

USA . 2,532 parts In-Stock

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2,532

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Distributors (Availability)

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Native Components

USA . 785 parts In-Stock

1+ parts

$1.066

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-

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785

$1.066

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Northwest PG Solutions

USA . 1,297 parts In-Stock

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$1.172

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-

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1,297

$1.172

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Andel Nordic

Denmark . 520 parts In-Stock

1+ parts

$6.297

100+ parts

-

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$6.045

10k+ parts

$6.045

520

$6.297

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$6.045

$6.045

Parana Technologies

USA . 2,284 parts In-Stock

1+ parts

$10.249

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-

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$10.785

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2,284

$10.249

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$10.785

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DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$11.286

100+ parts

$10.383

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1,766

$11.286

$10.383

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ChromeModa Solutions

Germany . 4,606 parts In-Stock

1+ parts

$11.516

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$9.443

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4,606

$11.516

$9.443

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IDEA Electronic Components Group

UK . 594 parts In-Stock

1+ parts

$11.516

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$10.940

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$10.364

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594

$11.516

$10.940

$10.364

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AZTECH Wire

Italy . 841 parts In-Stock

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$12.909

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841

$12.909

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One Stop Electronics

USA . 1,121 parts In-Stock

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$29.000

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$29.000

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A-Z Elektronik GmbH

Germany . 5,223 parts In-Stock

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Corphita

USA . 3,430 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Microchip USA

USA . 402 parts In-Stock

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Perfect Parts

USA . 353 parts In-Stock

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353

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Overview

Enhance your electronic projects with the 74LVTH162245DLRG4 by Texas Instruments, a top-quality bus driver and transceiver that ensures reliable performance. Manufactured by the trusted Texas Instruments brand, this product offers seamless data transmission and control in a compact package. Ideal for a wide range of applications, this versatile component provides value and efficiency to customers looking for high-quality solutions. Upgrade your designs today with the exceptional capabilities of the 74LVTH162245DLRG4!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for use in automotive applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 4 ns

The low propagation delay at nominal supply voltage ensures fast and efficient data transmission, making this product suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on printed circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single device offers cost savings and simplifies design complexity, making it a versatile choice for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The use of a commonly available supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures up to 85°C makes this product suitable for industrial environments where temperature fluctuations are common.

Technology: BICMOS

The use of BiCMOS technology offers a combination of the advantages of both bipolar and CMOS technologies, providing high performance, low power consumption, and improved reliability.

Technical Specifications

Bus Driver & Transceivers 74LVTH162245DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.49 mm

Trade Compliance

74LVTH162245DLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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