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74LVCH8T245DWRG4

Texas Instruments

74LVCH8T245DWRG4 by Texas Instruments

74LVCH8T245DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.2ns and operates at a nominal voltage of 1.8V. It features a small outline package, true output polarity, and is ideal for bidirectional control applications in industrial settings due to its wide operating temperature range from -40°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,926 parts In-Stock

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Digiode

USA . 866 parts In-Stock

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Native Components

USA . 314 parts In-Stock

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$0.032

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$0.031

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AZTECH Wire

Italy . 292 parts In-Stock

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$7.199

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Parana Technologies

USA . 786 parts In-Stock

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ChromeModa Solutions

Germany . 3,206 parts In-Stock

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$9.901

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IDEA Electronic Components Group

UK . 1,589 parts In-Stock

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$9.901

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$9.406

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$8.911

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One Stop Electronics

USA . 1,192 parts In-Stock

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$23.000

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Corohmni

South Africa . 321 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$35.044

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$31.890

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Northwest PG Solutions

USA . 2,034 parts In-Stock

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DigiPath Technology Company

USA . 1,230 parts In-Stock

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Corphita

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Microchip USA

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Overview

Upgrade your bus driver & transceiver game with the Texas Instruments 74LVCH8T245DWRG4! Manufactured by the renowned Texas Instruments, this product guarantees high quality and reliability. Ideal for various applications, this bus driver & transceiver offers customers unmatched value and benefits. Say goodbye to slow propagation delays and hello to seamless data transmission with this top-of-the-line product. Upgrade your systems today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement makes the product energy-efficient and suitable for applications where power consumption is a concern.

No. of Terminals: 24

Ample number of terminals provide flexibility in connecting external devices and peripherals, making the product versatile in various system configurations.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to function reliably in diverse environmental conditions, expanding its usability in different applications.

Technical Specifications

Bus Driver & Transceivers 74LVCH8T245DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

23.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

74LVCH8T245DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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