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74LVC2G126DCURG4

Texas Instruments

74LVC2G126DCURG4 by Texas Instruments

74LVC2G126DCURG4 by Texas Instruments is a bus driver with 2 functions, featuring a propagation delay of 4 ns and operating temperature range of -40 to 85 °C. It is ideal for industrial applications requiring true output polarity control at supply voltages ranging from 1.65V to 5.5V.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,441 parts In-Stock

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Semi Source

USA . 2,635 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 371 parts In-Stock

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Digiode

USA . 90 parts In-Stock

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Andel Nordic

Denmark . 124 parts In-Stock

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$6.956

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$6.678

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$6.678

124

$6.956

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$6.678

$6.678

Parana Technologies

USA . 1,821 parts In-Stock

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$9.454

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$10.065

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DigiPath Technology Company

USA . 300 parts In-Stock

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$10.410

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$10.410

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

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$10.622

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$10.091

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$9.560

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$10.622

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ChromeModa Solutions

Germany . 1,148 parts In-Stock

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$10.622

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$8.710

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AZTECH Wire

Italy . 504 parts In-Stock

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$16.933

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One Stop Electronics

USA . 579 parts In-Stock

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$46.000

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Corphita

USA . 1,738 parts In-Stock

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Northwest PG Solutions

USA . 1,229 parts In-Stock

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Microchip USA

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Native Components

USA . 56 parts In-Stock

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Overview

Looking for a reliable and high-quality solution for your bus driver and transceiver needs? Look no further than the 74LVC2G126DCURG4 by Texas Instruments. With its advanced technology and industrial-grade design, this product offers fast propagation delay, true output polarity, and 3-state output characteristics. Perfect for a wide range of applications, this small outline package is ideal for customers looking for efficient and versatile solutions. Trust Texas Instruments to deliver top-notch performance and value with the 74LVC2G126DCURG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 4 ns

With a low propagation delay, this product ensures quick signal transmission, resulting in efficient and fast communication within the bus driver or transceiver system.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption and overall energy efficiency of the product.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when disabled, providing flexibility in controlling the bus signals and minimizing interference with other components.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of input signals, making it a reliable choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74LVC2G126DCURG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

74LVC2G126DCURG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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