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74LVC1G240DCKTG4

Texas Instruments

74LVC1G240DCKTG4 by Texas Instruments

74LVC1G240DCKTG4 by Texas Instruments is a CMOS bus driver with 4.5 ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 1.8V and has a load capacitance of 50 pF. With a compact package style and surface mount capability, it offers efficient signal transmission in tight spaces.

Median Price

$0.815

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 231,243 parts In-Stock

1+ parts

$0.815

100+ parts

$0.554

1k+ parts

$0.284

10k+ parts

-

231,243

$0.815

$0.554

$0.284

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,305 parts In-Stock

1+ parts

$0.774

100+ parts

-

1k+ parts

-

10k+ parts

-

3,305

$0.774

-

-

-

Vyrian

USA . 3,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,354

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,580 parts In-Stock

1+ parts

$0.734

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

$0.734

-

-

-

AZTECH Wire

Italy . 1,110 parts In-Stock

1+ parts

$10.110

100+ parts

-

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-

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1,110

$10.110

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-

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Parana Technologies

USA . 2,159 parts In-Stock

1+ parts

$27.570

100+ parts

-

1k+ parts

$37.445

10k+ parts

-

2,159

$27.570

-

$37.445

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DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

$30.358

100+ parts

-

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-

10k+ parts

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333

$30.358

-

-

-

IDEA Electronic Components Group

UK . 1,022 parts In-Stock

1+ parts

$30.978

100+ parts

$29.429

1k+ parts

$27.880

10k+ parts

-

1,022

$30.978

$29.429

$27.880

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ChromeModa Solutions

Germany . 540 parts In-Stock

1+ parts

$30.978

100+ parts

$25.402

1k+ parts

-

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540

$30.978

$25.402

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-

Native Components

USA . 881 parts In-Stock

1+ parts

$45.350

100+ parts

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10k+ parts

$43.536

881

$45.350

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-

$43.536

Northwest PG Solutions

USA . 1,671 parts In-Stock

1+ parts

$49.885

100+ parts

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1,671

$49.885

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Microchip USA

USA . 2,842 parts In-Stock

1+ parts

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2,842

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Overview

Unlock seamless communication with the Texas Instruments 74LVC1G240DCKTG4 Bus Driver & Transceivers. Crafted with precision and reliability in mind, Texas Instruments delivers unparalleled quality in every product. Ideal for automotive applications, this innovative device boasts a quick propagation delay and low power consumption, providing customers with efficient and cost-effective solutions. Stay ahead of the competition with the unbeatable value and performance of the Texas Instruments 74LVC1G240DCKTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and reliability, making this product suitable for rough and tough environments.

Propagation Delay At Nominal Supply: 4.5 ns

With a low propagation delay, this bus driver & transceiver offers fast signal transmission, making it ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes installation easier and allows for compact design integration in various electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization and easy placement on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this product energy-efficient and suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures proper signal transmission and reception, improving the overall performance of the bus driver & transceiver.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for the bus driver & transceiver to control multiple bus lines, enhancing flexibility in system design.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it ideal for various industrial and automotive applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G240DCKTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

74LVC1G240DCKTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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