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74LVC1G240DBVTG4

Texas Instruments

74LVC1G240DBVTG4 by Texas Instruments

74LVC1G240DBVTG4 by Texas Instruments is a bus driver with 4.5ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a load capacitance of 50pF, making it ideal for low-power systems requiring fast signal transmission. With a compact package style and surface-mount capability, this CMOS technology device offers inverted output polarity and 3-state output characteristics for efficient signal control in tight spaces.

Median Price

$0.815

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 226,000 parts In-Stock

1+ parts

$0.815

100+ parts

$0.554

1k+ parts

$0.284

10k+ parts

-

226,000

$0.815

$0.554

$0.284

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,038 parts In-Stock

1+ parts

$0.774

100+ parts

-

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-

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2,038

$0.774

-

-

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Vyrian

USA . 2,263 parts In-Stock

1+ parts

-

100+ parts

-

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2,263

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,373 parts In-Stock

1+ parts

$0.734

100+ parts

-

1k+ parts

-

10k+ parts

-

2,373

$0.734

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-

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Native Components

USA . 354 parts In-Stock

1+ parts

$1.314

100+ parts

-

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-

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354

$1.314

-

-

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Northwest PG Solutions

USA . 682 parts In-Stock

1+ parts

$1.446

100+ parts

-

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682

$1.446

-

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Component Stockers USA

USA . 6,214 parts In-Stock

1+ parts

$7.000

100+ parts

-

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6,214

$7.000

-

-

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AZTECH Wire

Italy . 617 parts In-Stock

1+ parts

$8.080

100+ parts

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617

$8.080

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Andel Nordic

Denmark . 159 parts In-Stock

1+ parts

$8.375

100+ parts

-

1k+ parts

$8.040

10k+ parts

$8.040

159

$8.375

-

$8.040

$8.040

Parana Technologies

USA . 2,192 parts In-Stock

1+ parts

$21.923

100+ parts

-

1k+ parts

$22.426

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2,192

$21.923

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$22.426

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$24.140

100+ parts

-

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1,984

$24.140

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ChromeModa Solutions

Germany . 2,153 parts In-Stock

1+ parts

$24.633

100+ parts

$20.199

1k+ parts

-

10k+ parts

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2,153

$24.633

$20.199

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IDEA Electronic Components Group

UK . 2,072 parts In-Stock

1+ parts

$24.633

100+ parts

$23.401

1k+ parts

$22.170

10k+ parts

-

2,072

$24.633

$23.401

$22.170

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Microchip USA

USA . 2,072 parts In-Stock

1+ parts

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2,072

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Overview

Elevate your electronic designs with the high-quality 74LVC1G240DBVTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch performance and reliability. This bus driver and transceiver is perfect for a wide range of applications. Offering unparalleled value, this product provides fast propagation delay, low power consumption, and a compact design. Upgrade your projects with the Texas Instruments 74LVC1G240DBVTG4 for optimal results every time.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for long-term use in various environments.

Propagation Delay At Nominal Supply - 4.5 ns

Low propagation delay ensures quick signal transmission, making this product efficient for high-speed data communication.

Surface Mount - YES

Surface mount capability makes installation easier and more flexible, allowing for smaller PCB footprint and higher component density.

Nominal Supply Voltage / Vsup (V) - 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption and heat dissipation, making it energy-efficient.

Load Capacitance (CL) - 50 pF

Suitable load capacitance of 50 pF ensures stable signal transmission and reception, improving the overall performance of the product.

Power Supplies (V) - 3.3

Supporting power supplies of 3.3V makes this product compatible with a wide range of devices and systems operating at this voltage.

No. of Terminals - 5

Having 5 terminals offers connectivity options and flexibility in circuit design, catering to various configurations and requirements.

Package Style (Meter) - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile package style with shrink pitch design saves space on the PCB and enables efficient heat dissipation, enhancing overall system performance.

Maximum I (ol) - 32 Amp

High output current capability of 32A ensures reliable and robust signal transmission, making this product suitable for demanding applications.

Propagation Delay (tpd) - 8.6 ns

Low propagation delay of 8.6 ns ensures fast signal propagation, reducing latency in data communication and enhancing system responsiveness.

Maximum Operating Temperature - 125 °C

Wide operating temperature range up to 125°C ensures reliable performance in harsh environmental conditions and industrial applications.

Output Characteristics - 3-STATE

3-STATE output characteristics provide flexibility in controlling signal output, allowing for high impedance state when not actively driving signals.

Minimum Operating Temperature - -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments, making this product suitable for automotive and industrial applications.

Terminal Finish - Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides corrosion resistance and reliable solder joints, enhancing the longevity and performance of the product.

Terminal Position - DUAL

Dual terminal position offers flexibility in PCB design and layout, allowing for customized configurations and ensuring reliable connectivity.

No. of Ports - 2

Having 2 ports enables connectivity to multiple devices or circuits, expanding the utility and versatility of the product in various applications.

Maximum Seated Height - 1.45 mm

Low maximum seated height of 1.45 mm saves vertical space on the PCB and allows for compact system design, making it suitable for space-constrained applications.

Width - 1.6 mm

Compact width of 1.6 mm allows for dense packing and space-efficient PCB layout, enabling high-performance and reliable system integration.

Output Polarity - INVERTED

Inverted output polarity provides compatibility with systems and devices requiring an inverted signal, enhancing the product's versatility and usability.

Minimum Supply Voltage (Vsup) - 1.65 V

Low minimum supply voltage of 1.65V ensures compatibility with low-power devices and systems, offering energy-efficient operation and extended battery life.

Peak Reflow Temperature °C - 260

High peak reflow temperature of 260°C ensures reliable and robust soldering during assembly, maintaining the product's structural integrity under thermal stress.

Length - 2.9 mm

Compact length of 2.9 mm saves space on the PCB and allows for efficient and streamlined system integration, ideal for compact and portable devices.

Temperature Grade - AUTOMOTIVE

Automotive temperature grade certification ensures reliable performance in automotive applications, meeting industry standards for durability and functionality in harsh environments.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-operated devices and noise-sensitive applications.

Terminal Form - GULL WING

Gull wing terminal form provides ease of soldering and robust mechanical strength, ensuring reliable connectivity and long-term performance of the product.

Packing Method - TR

TR (Tape and Reel) packing method facilitates automated assembly processes and ensures efficient handling and storage of the product, reducing production time and costs.

Terminal Pitch - 0.95 mm

Narrow terminal pitch of 0.95 mm allows for high-density mounting on the PCB, enabling compact and space-efficient circuit design for enhanced system performance.

Count Direction - UNIDIRECTIONAL

Unidirectional count direction simplifies signal transmission and reception, ensuring seamless communication in one direction, suitable for specific applications requiring unidirectional data flow.

Control Type - ENABLE LOW

Enable low control type allows for efficient and precise control of the device, enhancing system functionality and adaptability in various applications.

Maximum Supply Voltage (Vsup) - 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources, offering versatility and flexibility in system integration.

Maximum Power Supply Current (ICC) - 0.01 mA

Low maximum power supply current of 0.01mA indicates energy-efficient operation and minimal power consumption, making this product ideal for power-sensitive and battery-powered applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G240DBVTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

74LVC1G240DBVTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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