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74LVC1G139DCUTG4

Texas Instruments

74LVC1G139DCUTG4 by Texas Instruments

74LVC1G139DCUTG4 by Texas Instruments is a CMOS Decoder & Driver with 5.9ns Propagation Delay, 16.7ns tpd, and 32A Max Iol. It operates at a supply voltage of 1.8V to 3.3V and is ideal for industrial applications requiring INVERTED output polarity in a small outline package with 0.5mm terminal pitch.

Median Price

$1.019

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 53,298 parts In-Stock

1+ parts

$1.019

100+ parts

$0.692

1k+ parts

$0.355

10k+ parts

-

53,298

$1.019

$0.692

$0.355

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.355

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-

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500

$0.355

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Digiode

USA . 2,810 parts In-Stock

1+ parts

$0.968

100+ parts

-

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2,810

$0.968

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Vyrian

USA . 7,024 parts In-Stock

1+ parts

-

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7,024

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VNN

France . 4,175 parts In-Stock

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4,175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.355

100+ parts

$0.348

1k+ parts

-

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2,000

$0.355

$0.348

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Ampacity Inc.

Singapore . 53,144 parts In-Stock

1+ parts

$0.870

100+ parts

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53,144

$0.870

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Corphita

USA . 3,597 parts In-Stock

1+ parts

$0.917

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3,597

$0.917

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Parana Technologies

USA . 876 parts In-Stock

1+ parts

$10.356

100+ parts

-

1k+ parts

$10.873

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876

$10.356

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$10.873

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DigiPath Technology Company

USA . 1 parts In-Stock

1+ parts

$11.403

100+ parts

-

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1

$11.403

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ChromeModa Solutions

Germany . 2,502 parts In-Stock

1+ parts

$11.636

100+ parts

$9.542

1k+ parts

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2,502

$11.636

$9.542

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IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$11.636

100+ parts

$11.054

1k+ parts

$10.472

10k+ parts

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1,992

$11.636

$11.054

$10.472

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AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$18.940

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820

$18.940

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Microchip USA

USA . 2,645 parts In-Stock

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2,645

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Overview

Discover the top-tier quality and reliability of Texas Instruments with the 74LVC1G139DCUTG4, a cutting-edge Decoder & Drivers component that is sure to enhance your electronic projects. Whether you're a seasoned professional or a DIY enthusiast, this product offers unparalleled performance and precision. With a compact package body material and impressive features like standard input conditioning and a wide operating temperature range, this decoder ensures seamless operation in a variety of applications. Upgrade your designs today with the Texas Instruments 74LVC1G139DCUTG4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides durability and protection for the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 5.9 ns

The low propagation delay ensures fast signal processing, making this decoder & driver suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V results in energy efficiency and low power consumption.

Output Characteristics: 3-STATE

The 3-STATE output allows for high flexibility in connecting multiple devices or circuits.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder & driver reliable and energy-efficient.

Technical Specifications

Decoder & Drivers 74LVC1G139DCUTG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

16.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

74LVC1G139DCUTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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