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74LVC16373DGGRE4

Texas Instruments

74LVC16373DGGRE4 by Texas Instruments

74LVC16373DGGRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7 ns and output characteristics in the form of 3-STATE. It operates at a nominal voltage of 3.3V, making it suitable for industrial applications requiring fast signal transmission and low power consumption. The package style is small outline, thin profile, shrink pitch, ideal for compact designs with limited space constraints.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,899 parts In-Stock

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Digiode

USA . 4,794 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Andel Nordic

Denmark . 72 parts In-Stock

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$3.448

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-

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$3.310

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$3.310

72

$3.448

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$3.310

$3.310

AZTECH Wire

Italy . 421 parts In-Stock

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$12.860

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Parana Technologies

USA . 418 parts In-Stock

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$14.185

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$14.641

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

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$15.938

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$15.141

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$14.344

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2,156

$15.938

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ChromeModa Solutions

Germany . 532 parts In-Stock

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$15.938

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$13.069

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532

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One Stop Electronics

USA . 1,571 parts In-Stock

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$34.000

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DigiPath Technology Company

USA . 2,023 parts In-Stock

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$14.370

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Corphita

USA . 1,021 parts In-Stock

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Native Components

USA . 946 parts In-Stock

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Northwest PG Solutions

USA . 832 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the Texas Instruments 74LVC16373DGGRE4 Bus Driver & Transceivers. Crafted with precision using top-notch materials, this product offers seamless integration and exceptional functionality for a wide range of applications. From industrial automation to telecommunications, this cutting-edge technology provides unmatched value, efficiency, and versatility. Elevate your projects with the innovative features and superior quality that Texas Instruments is renowned for. Experience the difference with the 74LVC16373DGGRE4 and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 7 ns

Fast propagation delay ensures quick response time in signal transmission.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

No. of Functions: 2

Multiple functions in one component save space and simplify circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltage for ease of integration.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable performance in transmitting signals.

Power Supplies (V): 3.3

Efficient power supply for reliable and consistent operation.

Output Characteristics: 3-STATE

3-state output allows for high-impedance state, increasing flexibility in signal routing.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers 74LVC16373DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74LVC16373DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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