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74FCT2374CTSOCTG4

Texas Instruments

74FCT2374CTSOCTG4 by Texas Instruments

Texas Instruments 74FCT2374CTSOCTG4 is an 8-bit bus driver with 5.2 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V, has a load capacitance of 50 pF, and features a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,285 parts In-Stock

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Vyrian

USA . 2,937 parts In-Stock

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Andel Nordic

Denmark . 472 parts In-Stock

1+ parts

$5.686

100+ parts

-

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$5.458

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$5.458

472

$5.686

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$5.458

$5.458

One Stop Electronics

USA . 1,161 parts In-Stock

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$6.000

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Native Components

USA . 379 parts In-Stock

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$7.282

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Parana Technologies

USA . 705 parts In-Stock

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$9.315

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$9.940

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705

$9.315

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$9.940

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DigiPath Technology Company

USA . 2,374 parts In-Stock

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$10.257

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$9.436

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$10.257

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AZTECH Wire

Italy . 404 parts In-Stock

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$10.291

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404

$10.291

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ChromeModa Solutions

Germany . 6,249 parts In-Stock

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$10.466

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$8.582

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$8.582

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IDEA Electronic Components Group

UK . 864 parts In-Stock

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$10.466

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$9.943

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$9.419

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Corphita

USA . 4,721 parts In-Stock

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Northwest PG Solutions

USA . 725 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the Texas Instruments 74FCT2374CTSOCTG4 Bus Driver & Transceivers. Manufactured by a trusted leader in the industry, this product offers reliable performance and durability. Ideal for a wide range of applications, this 8-bit transceiver ensures seamless data transmission with a low propagation delay of 5.2 ns. With its compact design and high-quality construction, this device provides exceptional value and benefits to customers looking for a dependable solution for their projects. Experience the advantages of Texas Instruments technology with the 74FCT2374CTSOCTG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides a lightweight and durable construction, making this product suitable for use in various environments.

Propagation Delay At Nominal Supply: 5.2 ns

The low propagation delay ensures fast signal transmission, making this product efficient for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits, this product provides sufficient data transmission capability for a wide range of applications, making it versatile and practical.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with existing systems easy and ensures compatibility with other components.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the maximum capacitance that can be connected to the output of the device, ensuring stable and reliable performance.

Power Supplies (V): 5

Having a single power supply voltage requirement simplifies the design and power management aspect, making it convenient for users to incorporate this product into their systems.

No. of Terminals: 20

The ample number of terminals allow for easy connectivity and interfacing with other components, enhancing the flexibility and usability of this product.

Maximum I (ol): 12 Amp

The high maximum output current capability ensures the product can drive loads effectively, making it suitable for driving various types of transceivers and bus systems.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this product is reliable and resilient in harsh environmental conditions, ensuring consistent performance in demanding applications.

Technical Specifications

Bus Driver & Transceivers 74FCT2374CTSOCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74FCT2374CTSOCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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