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74FCT16952ATPVCG4

Texas Instruments

74FCT16952ATPVCG4 by Texas Instruments

74FCT16952ATPVCG4 by Texas Instruments is a Bus Driver & Transceiver with 10ns Propagation Delay, suitable for industrial applications. It features 8 bits, operates at 5V, and has a max I (ol) of 64A. This CMOS technology device has dual terminal position and supports bidirectional count direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,035 parts In-Stock

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Digiode

USA . 2,841 parts In-Stock

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2,841

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Distributors (Availability)

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Native Components

USA . 107 parts In-Stock

1+ parts

$0.080

100+ parts

-

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$0.077

107

$0.080

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$0.077

Northwest PG Solutions

USA . 1,288 parts In-Stock

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$0.088

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-

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$0.078

1,288

$0.088

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$0.078

Andel Nordic

Denmark . 495 parts In-Stock

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$4.422

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-

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$4.245

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$4.245

495

$4.422

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$4.245

$4.245

AZTECH Wire

Italy . 190 parts In-Stock

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$15.690

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Parana Technologies

USA . 1,530 parts In-Stock

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$21.549

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$21.937

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$21.549

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ChromeModa Solutions

Germany . 5,132 parts In-Stock

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$24.212

100+ parts

$19.854

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$24.212

$19.854

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IDEA Electronic Components Group

UK . 104 parts In-Stock

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$24.212

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$23.001

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$21.791

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One Stop Electronics

USA . 890 parts In-Stock

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$30.000

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$30.000

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DigiPath Technology Company

USA . 2,365 parts In-Stock

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$21.830

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Corphita

USA . 2,324 parts In-Stock

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Microchip USA

USA . 1,996 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments 74FCT16952ATPVCG4. As a top-tier manufacturer in the industry, Texas Instruments guarantees reliability and quality in every product. This bus driver & transceiver boasts fast propagation delay, dual functions, and true output polarity, making it ideal for a wide range of applications. From industrial to consumer electronics, this versatile component offers exceptional value, efficiency, and performance. Upgrade your projects today with the Texas Instruments 74FCT16952ATPVCG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver and transceiver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures fast signal transmission and response times, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in a single device increases versatility and efficiency in circuit design and implementation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage simplifies power management and compatibility with other components in the system.

No. of Terminals: 56

Having a high number of terminals provides flexibility in connecting to various components and peripherals, accommodating complex interfacing requirements.

Output Characteristics: 3-STATE

3-state output allows the device to actively drive the bus line high, drive it low, or go into a high-impedance state, enabling efficient bus control and management.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Using high-quality terminal finish enhances conductivity and ensures reliable connections, contributing to overall performance and longevity of the product.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product energy-efficient and versatile.

Technical Specifications

Bus Driver & Transceivers 74FCT16952ATPVCG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74FCT16952ATPVCG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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