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74FCT16823CTPVCTG4

Texas Instruments

74FCT16823CTPVCTG4 by Texas Instruments

74FCT16823CTPVCTG4 by Texas Instruments is a Bus Driver & Transceiver with 9 bits, 2 functions, and 3-STATE output characteristics. It has a propagation delay of 6 ns at nominal voltage of 5V, making it ideal for industrial applications requiring fast signal transmission in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,946 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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Andel Nordic

Denmark . 193 parts In-Stock

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$3.852

100+ parts

-

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$3.698

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$3.698

193

$3.852

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$3.698

$3.698

AZTECH Wire

Italy . 898 parts In-Stock

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$10.522

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Parana Technologies

USA . 728 parts In-Stock

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$21.160

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$1,965.004

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$19.044

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728

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$1,965.004

$19.044

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DigiPath Technology Company

USA . 785 parts In-Stock

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$23.300

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$21.436

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785

$23.300

$21.436

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ChromeModa Solutions

Germany . 4,876 parts In-Stock

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$23.775

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$19.496

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$23.775

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IDEA Electronic Components Group

UK . 703 parts In-Stock

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$23.775

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$22.586

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$21.398

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703

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One Stop Electronics

USA . 1,254 parts In-Stock

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$50.000

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QUARKTWIN TECHNOLOGY LTD

USA . 11,248 parts In-Stock

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Northwest PG Solutions

USA . 1,517 parts In-Stock

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Native Components

USA . 852 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock superior performance and reliability with the Texas Instruments 74FCT16823CTPVCTG4, a top-notch Bus Driver & Transceiver. Crafted by the industry leader in semiconductor technology, this product offers unmatched quality and precision. Ideal for a wide range of applications, this versatile component ensures seamless communication and data transfer. Experience the value and benefits of Texas Instruments technology with the 74FCT16823CTPVCTG4, delivering unparalleled efficiency and functionality to meet all your needs. Elevate your projects with this premium solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast data transfer and efficient communication within the system.

No. of Functions: 2

Having multiple functions allows for versatile usage and compatibility with different systems and configurations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration into existing setups easier and ensures compatibility.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance states, enabling bus sharing and preventing bus contention issues.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers 74FCT16823CTPVCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74FCT16823CTPVCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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