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74FCT16374TPVCTG4

Texas Instruments

74FCT16374TPVCTG4 by Texas Instruments

74FCT16374TPVCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10 ns at 5V. It features a small outline package, operates b/w -40 to 85°C, and has a max I (ol) of 64 Amp. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,187 parts In-Stock

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Digiode

USA . 4,617 parts In-Stock

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Andel Nordic

Denmark . 32 parts In-Stock

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$3.461

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$3.322

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$3.322

32

$3.461

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$3.322

$3.322

AZTECH Wire

Italy . 497 parts In-Stock

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$5.556

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One Stop Electronics

USA . 348 parts In-Stock

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$8.000

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Parana Technologies

USA . 794 parts In-Stock

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$25.442

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$26.074

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DigiPath Technology Company

USA . 2,094 parts In-Stock

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$28.015

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$25.774

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$28.015

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IDEA Electronic Components Group

UK . 2,089 parts In-Stock

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$28.587

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$27.158

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$25.728

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$25.728

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ChromeModa Solutions

Germany . 1,612 parts In-Stock

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$28.587

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$23.441

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Corphita

USA . 3,335 parts In-Stock

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Northwest PG Solutions

USA . 2,300 parts In-Stock

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Microchip USA

USA . 476 parts In-Stock

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Native Components

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Overview

Unlock unparalleled performance with the Texas Instruments 74FCT16374TPVCTG4 Bus Driver & Transceivers. Known for their top-tier quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this product offers seamless connectivity and high-speed data transmission. Elevate your projects with the unmatched value and benefits of the 74FCT16374TPVCTG4, setting a new standard in efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver and transceiver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 10 ns

Fast propagation delay ensures quick data transmission and efficient performance of the bus driver and transceiver, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design, making the bus driver and transceiver suitable for compact electronic devices.

No. of Functions: 2

Having multiple functions in a single component provides versatility and efficiency in circuit design, making the bus driver and transceiver a cost-effective choice.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of electronic systems, making the bus driver and transceiver a versatile option.

No. of Bits: 8

Having 8 bits allows for greater data processing capabilities, making the bus driver and transceiver suitable for applications requiring complex data manipulation.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance of the bus driver and transceiver, making it a reliable choice for continuous operation.

Maximum Seated Height: 2.79 mm

Low seated height allows for compact and space-efficient PCB design, making the bus driver and transceiver suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making the bus driver and transceiver suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus driver and transceiver energy-efficient and reliable for data transmission.

Technical Specifications

Bus Driver & Transceivers 74FCT16374TPVCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74FCT16374TPVCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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