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74FCT16245TPACTE4

Texas Instruments

74FCT16245TPACTE4 by Texas Instruments

74FCT16245TPACTE4 by Texas Instruments is a CMOS bus driver with 8 bits, 2 functions, and 3-STATE output characteristics. It operates at a nominal voltage of 5V with a propagation delay of 7ns, making it suitable for bidirectional control applications in industrial settings. The package style is small outline with dual terminal position and gull wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,528 parts In-Stock

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Digiode

USA . 1,089 parts In-Stock

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1,089

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Distributors (Availability)

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Andel Nordic

Denmark . 325 parts In-Stock

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$5.784

100+ parts

-

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$5.553

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$5.553

325

$5.784

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$5.553

$5.553

AZTECH Wire

Italy . 791 parts In-Stock

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$16.184

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Parana Technologies

USA . 153 parts In-Stock

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$22.337

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$23.014

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$23.014

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ChromeModa Solutions

Germany . 6,357 parts In-Stock

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$25.098

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$20.580

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IDEA Electronic Components Group

UK . 1,150 parts In-Stock

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$25.098

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$23.843

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$22.588

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$25.098

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$22.588

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One Stop Electronics

USA . 1,168 parts In-Stock

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$41.000

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Component Stockers USA

USA . 302 parts In-Stock

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$99.990

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Microchip USA

USA . 2,303 parts In-Stock

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Corphita

USA . 2,189 parts In-Stock

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$22.628

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Northwest PG Solutions

USA . 1,659 parts In-Stock

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$4.499

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Native Components

USA . 582 parts In-Stock

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$4.453

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$4.453

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Overview

Elevate your designs with the 74FCT16245TPACTE4 by Texas Instruments, a top-tier bus driver & transceiver that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product boasts a durable plastic/epoxy package body material and a wide range of applications in various industries. With fast propagation delay, true output polarity, and 3-state output characteristics, this component ensures seamless operation and optimal performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing value and benefits to customers seeking efficient and innovative solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures fast communication and response times, making it suitable for high-speed applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and allowing for efficient production processes.

No. of Functions: 2

Ability to perform multiple functions in a single device, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply makes it compatible with a wide range of systems and applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, providing flexibility in controlling bus lines and reducing power consumption.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with temperature variations, ensuring reliable operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers 74FCT16245TPACTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74FCT16245TPACTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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