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74F521MSAX

Texas Instruments

74F521MSAX by Texas Instruments

74F521MSAX by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 11ns. It operates at a supply voltage range of 4.5V to 5.5V and has a temperature range of 0°C to 70°C. This TTL technology chip is ideal for applications requiring fast arithmetic calculations in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,616 parts In-Stock

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Digiode

USA . 3,037 parts In-Stock

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Anansix

USA . 2,889 parts In-Stock

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Native Components

USA . 399 parts In-Stock

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$1.404

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Northwest PG Solutions

USA . 652 parts In-Stock

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$1.545

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652

$1.545

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Andel Nordic

Denmark . 211 parts In-Stock

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$4.640

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$4.454

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$4.454

211

$4.640

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$4.454

$4.454

Parana Technologies

USA . 1,191 parts In-Stock

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$17.461

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$17.658

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$17.461

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AZTECH Wire

Italy . 580 parts In-Stock

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$18.115

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DigiPath Technology Company

USA . 1,731 parts In-Stock

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$19.227

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ChromeModa Solutions

Germany . 5,576 parts In-Stock

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$19.619

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$16.088

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IDEA Electronic Components Group

UK . 1,899 parts In-Stock

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$19.619

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$18.638

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$17.657

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One Stop Electronics

USA . 1,490 parts In-Stock

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$36.000

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QUARKTWIN TECHNOLOGY LTD

USA . 12,904 parts In-Stock

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Corphita

USA . 1,627 parts In-Stock

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Supply Digital

USA . 1,054 parts In-Stock

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Microchip USA

USA . 391 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the high-quality 74F521MSAX by Texas Instruments. Trusted by professionals worldwide, Texas Instruments is known for its superior manufacturing standards and cutting-edge technology. This versatile product is perfect for a variety of applications, offering customers unmatched value and reliability. Upgrade your projects today with the innovative features and advantages this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the circuit, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

No. of Bits: 8

Having 8 bits allows for a wide range of mathematical calculations and operations, making the circuit versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common power sources, simplifying integration into existing systems.

Propagation Delay (tpd): 11 ns

Low propagation delay of 11ns ensures fast and efficient processing of arithmetic operations, contributing to overall system performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the circuit can withstand higher temperature environments without compromising performance.

Technology: TTL

TTL technology offers reliable and efficient digital signal processing, making the circuit suitable for a wide range of digital arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits 74F521MSAX attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

11 ns

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74F521MSAX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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