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74F158ASJX

Texas Instruments

74F158ASJX by Texas Instruments

The Texas Instruments 74F158ASJX is a TTL multiplexer with 4 functions and 2 inputs. It has a propagation delay of 7 ns at a nominal voltage of 5V, making it ideal for fast switching applications. With a small outline package style and surface mount capability, it is suitable for commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,539 parts In-Stock

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Vyrian

USA . 2,036 parts In-Stock

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Anansix

USA . 717 parts In-Stock

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717

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One Stop Electronics

USA . 694 parts In-Stock

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$8.000

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694

$8.000

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AZTECH Wire

Italy . 763 parts In-Stock

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$11.024

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763

$11.024

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Parana Technologies

USA . 1,716 parts In-Stock

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$23.029

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$23.673

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$23.029

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$23.673

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DigiPath Technology Company

USA . 327 parts In-Stock

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$25.358

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327

$25.358

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ChromeModa Solutions

Germany . 4,241 parts In-Stock

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$25.875

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$21.218

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$25.875

$21.218

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IDEA Electronic Components Group

UK . 2,009 parts In-Stock

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$25.875

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$24.581

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$23.288

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2,009

$25.875

$24.581

$23.288

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Corphita

USA . 3,989 parts In-Stock

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Northwest PG Solutions

USA . 2,243 parts In-Stock

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Supply Digital

USA . 1,502 parts In-Stock

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Native Components

USA . 311 parts In-Stock

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Overview

Upgrade your electronic projects with the 74F158ASJX by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a multiplexer & demultiplexer, this component offers seamless integration into various systems, providing efficient signal routing and processing. With a small outline package and inverted output polarity, this product delivers optimal performance in a compact form factor. Trust Texas Instruments to deliver cutting-edge technology that enhances the functionality of your designs. Elevate your projects with the 74F158ASJX and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures fast data transfer, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort in the manufacturing process.

No. of Functions: 4

Offers versatility and flexibility in signal routing, making it suitable for various applications such as data transmission and communication systems.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with other components in the system.

Technical Specifications

Multiplexer & Demultiplexer 74F158ASJX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.2 mm

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74F158ASJX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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