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74CBTLV3245APWRE4

Texas Instruments

74CBTLV3245APWRE4 by Texas Instruments

74CBTLV3245APWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 0.25 ns, suitable for industrial applications. It operates at a nominal voltage of 2.5 V and has a load capacitance of 50 pF. This surface-mount device features dual terminal position and true output polarity, making it ideal for bidirectional control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,647 parts In-Stock

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8,647

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Digiode

USA . 700 parts In-Stock

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700

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Distributors (Availability)

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Andel Nordic

Denmark . 358 parts In-Stock

1+ parts

$5.454

100+ parts

-

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$5.236

10k+ parts

$5.236

358

$5.454

-

$5.236

$5.236

One Stop Electronics

USA . 495 parts In-Stock

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$18.000

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-

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495

$18.000

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AZTECH Wire

Italy . 436 parts In-Stock

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$18.023

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436

$18.023

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Parana Technologies

USA . 54 parts In-Stock

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$27.412

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$35.559

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54

$27.412

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$35.559

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DigiPath Technology Company

USA . 605 parts In-Stock

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$30.184

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$27.769

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605

$30.184

$27.769

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

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$30.800

100+ parts

$29.260

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$27.720

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1,259

$30.800

$29.260

$27.720

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ChromeModa Solutions

Germany . 1,063 parts In-Stock

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$30.800

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$25.256

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1,063

$30.800

$25.256

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Microchip USA

USA . 2,247 parts In-Stock

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Northwest PG Solutions

USA . 1,174 parts In-Stock

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$4.132

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$4.132

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Native Components

USA . 834 parts In-Stock

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$4.090

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834

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$4.090

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$19.358

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$17.926

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$17.926

500

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$19.358

$17.926

$17.926

Corphita

USA . 419 parts In-Stock

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419

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Overview

Unlock seamless data transmission with the 74CBTLV3245APWRE4 by Texas Instruments, a cutting-edge Bus Driver & Transceiver. Crafted with precision and reliability in mind, this product boasts unparalleled performance in various applications. Offering lightning-fast propagation delay and a compact design, this transceiver guarantees efficient signal transfer in industrial-grade settings. Elevate your projects with Texas Instrument's superior quality and innovation. Experience the difference with the 74CBTLV3245APWRE4 - where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 0.25 ns

With a low propagation delay, this product ensures fast and efficient data transmission, making it suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the product on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage provides stable power to the product, ensuring consistent performance and reliability in operation.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C makes this product suitable for use in harsh environmental conditions, enhancing its versatility and durability.

Technical Specifications

Bus Driver & Transceivers 74CBTLV3245APWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

74CBTLV3245APWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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