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74CBTLV16212GRG4

Texas Instruments

74CBTLV16212GRG4 by Texas Instruments

74CBTLV16212GRG4 by Texas Instruments is a 22-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at supply voltages of 2.5/3.3 V and features a small outline package style with dual terminal position for compact designs. With a temperature range of -40 to 85 °C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,722 parts In-Stock

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Digiode

USA . 436 parts In-Stock

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Andel Nordic

Denmark . 320 parts In-Stock

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$7.207

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$6.919

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$6.919

320

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$6.919

$6.919

One Stop Electronics

USA . 1,435 parts In-Stock

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$13.000

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Parana Technologies

USA . 94 parts In-Stock

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$14.050

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$14.515

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AZTECH Wire

Italy . 207 parts In-Stock

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$15.306

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DigiPath Technology Company

USA . 1,405 parts In-Stock

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$15.471

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$14.234

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IDEA Electronic Components Group

UK . 2,304 parts In-Stock

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$15.787

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$14.998

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$14.208

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ChromeModa Solutions

Germany . 990 parts In-Stock

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$15.787

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$12.945

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Corphita

USA . 3,601 parts In-Stock

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Microchip USA

USA . 1,668 parts In-Stock

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Northwest PG Solutions

USA . 656 parts In-Stock

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Native Components

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Overview

Unlock seamless data transfer with the 74CBTLV16212GRG4 by Texas Instruments, a cutting-edge Bus Driver & Transceiver designed for efficiency and reliability. Crafted with precision using high-quality materials, this versatile component ensures lightning-fast propagation delay and robust output characteristics, making it ideal for a wide range of applications. Experience unparalleled performance and value with Texas Instruments' commitment to innovation, setting new standards in the industry. Elevate your projects with the 74CBTLV16212GRG4 and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast communication and response times, making the product efficient and reliable.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving space and time during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, ensuring compatibility with other components and systems.

No. of Terminals: 56

Offers a sufficient number of terminals for connectivity and versatility in system integrations.

Output Characteristics: 3-STATE

Supports tri-state logic output, allowing for easy control of signals and efficient data transmission.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat resistance is crucial.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the overall performance and efficiency of the product.

Technical Specifications

Bus Driver & Transceivers 74CBTLV16212GRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

22

No. of Functions:

1

No. of Ports:

4

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74CBTLV16212GRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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