Loading...

74CBTLV16211DLRG4

Texas Instruments

74CBTLV16211DLRG4 by Texas Instruments

74CBTLV16211DLRG4 by Texas Instruments is a 12-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 2.5 V and supports dual terminal position with GULL WING form factor. This CMOS technology device features TRUE output polarity and ENABLE LOW control type for bidirectional communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,841

-

-

-

-

Digiode

USA . 2,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,089

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 418 parts In-Stock

1+ parts

$2.831

100+ parts

-

1k+ parts

$2.718

10k+ parts

$2.718

418

$2.831

-

$2.718

$2.718

Parana Technologies

USA . 2,041 parts In-Stock

1+ parts

$7.652

100+ parts

-

1k+ parts

$8.173

10k+ parts

-

2,041

$7.652

-

$8.173

-

DigiPath Technology Company

USA . 1,528 parts In-Stock

1+ parts

$8.426

100+ parts

$7.752

1k+ parts

-

10k+ parts

-

1,528

$8.426

$7.752

-

-

ChromeModa Solutions

Germany . 3,672 parts In-Stock

1+ parts

$8.598

100+ parts

$7.050

1k+ parts

-

10k+ parts

-

3,672

$8.598

$7.050

-

-

IDEA Electronic Components Group

UK . 838 parts In-Stock

1+ parts

$8.598

100+ parts

$8.168

1k+ parts

$7.738

10k+ parts

-

838

$8.598

$8.168

$7.738

-

Native Components

USA . 25 parts In-Stock

1+ parts

$13.003

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$13.003

-

-

-

Northwest PG Solutions

USA . 161 parts In-Stock

1+ parts

$14.303

100+ parts

$12.873

1k+ parts

-

10k+ parts

-

161

$14.303

$12.873

-

-

One Stop Electronics

USA . 390 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

390

$18.000

-

-

-

AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$19.596

100+ parts

-

1k+ parts

-

10k+ parts

-

282

$19.596

-

-

-

Corphita

USA . 3,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,789

-

-

-

-

Microchip USA

USA . 2,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,596

-

-

-

-

Overview

Elevate your electronic designs with the 74CBTLV16211DLRG4 by Texas Instruments, a cutting-edge bus driver & transceiver that delivers unmatched quality and reliability. Crafted by the renowned manufacturer, this innovative product offers seamless integration, low power consumption, and ultra-fast propagation delay, making it ideal for a wide range of applications. Whether you're in the automotive, industrial, or consumer electronics industry, this versatile component will enhance your systems with its superior performance and efficiency. Trust Texas Instruments to provide you with the best-in-class solutions for your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.25 ns

With a low propagation delay, this product ensures fast signal transmission, making it suitable for high-speed data applications.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and making it ideal for compact electronic designs.

No. of Functions: 2

Having multiple functions in one device provides cost-effectiveness and efficiency in circuit design, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low supply voltage, contributing to energy efficiency and reducing power consumption.

Terminal Position: DUAL

Dual terminal positions allow for flexibility in PCB layout and potentially easier routing of connections, enhancing compatibility with various circuit designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and suitable for a wide range of applications.

Technical Specifications

Bus Driver & Transceivers 74CBTLV16211DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

12

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

74CBTLV16211DLRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20