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74CBTLV16210DLG4

Texas Instruments

74CBTLV16210DLG4 by Texas Instruments

74CBTLV16210DLG4 by Texas Instruments is a 10-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 2.5V and supports dual terminal position with true output polarity. The package style is small outline, shrink pitch, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,602 parts In-Stock

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Digiode

USA . 1,269 parts In-Stock

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1,269

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Distributors (Availability)

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Andel Nordic

Denmark . 24 parts In-Stock

1+ parts

$5.077

100+ parts

-

1k+ parts

$4.874

10k+ parts

$4.874

24

$5.077

-

$4.874

$4.874

AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$10.920

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400

$10.920

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Native Components

USA . 199 parts In-Stock

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$18.090

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199

$18.090

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Northwest PG Solutions

USA . 2,183 parts In-Stock

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$19.899

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$17.909

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2,183

$19.899

$17.909

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Parana Technologies

USA . 2,370 parts In-Stock

1+ parts

$23.791

100+ parts

$2,209.400

1k+ parts

$21.412

10k+ parts

-

2,370

$23.791

$2,209.400

$21.412

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DigiPath Technology Company

USA . 606 parts In-Stock

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$26.197

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606

$26.197

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ChromeModa Solutions

Germany . 4,461 parts In-Stock

1+ parts

$26.732

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$21.920

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4,461

$26.732

$21.920

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IDEA Electronic Components Group

UK . 32 parts In-Stock

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$26.732

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$25.395

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$24.059

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32

$26.732

$25.395

$24.059

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One Stop Electronics

USA . 1,313 parts In-Stock

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$53.000

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1,313

$53.000

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Corphita

USA . 2,552 parts In-Stock

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Microchip USA

USA . 1,801 parts In-Stock

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Overview

Experience seamless communication and data transmission with the 74CBTLV16210DLG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This bus driver & transceiver offers unmatched performance and efficiency, making it ideal for various applications. With a compact design and advanced technology, this product guarantees smooth operation and precise output. Elevate your projects with the exceptional value and benefits that the 74CBTLV16210DLG4 brings to the table. Trust in Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to damage, making this product reliable for long-term use in a variety of conditions.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed data transfer applications.

Surface Mount: YES

Surface mount design allows for easy installation and integration into electronic circuits, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component can streamline circuit design, reduce the number of components needed, and simplify system architecture.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a standard voltage of 2.5V ensures compatibility with common power supplies and stability in performance.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in controlling signal levels, allowing for high impedance and low power consumption when not in use.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making this product energy-efficient and versatile.

Technical Specifications

Bus Driver & Transceivers 74CBTLV16210DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

74CBTLV16210DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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