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74CBT16800CDGVRE4

Texas Instruments

74CBT16800CDGVRE4 by Texas Instruments

74CBT16800CDGVRE4 by Texas Instruments is a Bus Driver & Transceiver with 10 bits, 0.24 ns propagation delay, and 3-STATE output characteristics. It operates at a supply voltage of 5V and has an industrial temperature grade. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,789 parts In-Stock

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Digiode

USA . 2,065 parts In-Stock

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Andel Nordic

Denmark . 440 parts In-Stock

1+ parts

$4.696

100+ parts

-

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$4.508

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$4.508

440

$4.696

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$4.508

$4.508

One Stop Electronics

USA . 1,478 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 441 parts In-Stock

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$12.547

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Parana Technologies

USA . 879 parts In-Stock

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$17.347

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$17.555

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879

$17.347

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DigiPath Technology Company

USA . 854 parts In-Stock

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$19.101

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$17.573

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854

$19.101

$17.573

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ChromeModa Solutions

Germany . 2,848 parts In-Stock

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$19.491

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$15.983

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2,848

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

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$19.491

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$18.516

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$17.542

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QUARKTWIN TECHNOLOGY LTD

USA . 27,856 parts In-Stock

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Corphita

USA . 4,426 parts In-Stock

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Northwest PG Solutions

USA . 2,158 parts In-Stock

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Native Components

USA . 946 parts In-Stock

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Microchip USA

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Overview

Transform your electronic designs with the 74CBT16800CDGVRE4 by Texas Instruments, a top-of-the-line bus driver and transceiver that offers unmatched quality and reliability. Manufactured by the trusted brand Texas Instruments, this innovative product features 10 bits, 3-state output characteristics, and a propagation delay of just 0.24 ns. Ideal for a wide range of applications, this versatile component is designed to optimize performance and efficiency in industrial settings. Upgrade your projects with the cutting-edge technology and precision engineering of the 74CBT16800CDGVRE4, providing unparalleled value and benefits to our customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection to the internal components, making the product reliable and long-lasting.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Provides multiple functions in a single component, reducing the need for additional chips and improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems and power supplies.

Propagation Delay (tpd): 0.24 ns

Delivers fast signal transmission, ensuring quick response times and efficient data transfer.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers 74CBT16800CDGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G48

Length:

9.7 mm

Logic IC Type:

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

.24 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

74CBT16800CDGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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