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74CB3Q3244DBQRE4

Texas Instruments

74CB3Q3244DBQRE4 by Texas Instruments

74CB3Q3244DBQRE4 by Texas Instruments is a bus driver & transceiver with 0.2 ns propagation delay, suitable for industrial applications. It operates at 2.5/3.3V, has 20 terminals in a small outline package, and features true output polarity with 3-state characteristics.

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5,000 parts In-Stock

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-

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$0.438

5,000

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$0.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,288 parts In-Stock

1+ parts

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6,288

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Digiode

USA . 2,476 parts In-Stock

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2,476

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Distributors (Availability)

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Andel Nordic

Denmark . 516 parts In-Stock

1+ parts

$2.709

100+ parts

-

1k+ parts

$2.601

10k+ parts

$2.601

516

$2.709

-

$2.601

$2.601

AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$16.671

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-

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191

$16.671

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One Stop Electronics

USA . 1,491 parts In-Stock

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$26.000

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1,491

$26.000

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Parana Technologies

USA . 410 parts In-Stock

1+ parts

$30.240

100+ parts

$2,808.282

1k+ parts

$27.216

10k+ parts

-

410

$30.240

$2,808.282

$27.216

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DigiPath Technology Company

USA . 1,751 parts In-Stock

1+ parts

$33.298

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1,751

$33.298

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ChromeModa Solutions

Germany . 4,534 parts In-Stock

1+ parts

$33.978

100+ parts

$27.862

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4,534

$33.978

$27.862

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IDEA Electronic Components Group

UK . 290 parts In-Stock

1+ parts

$33.978

100+ parts

$32.279

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$30.580

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290

$33.978

$32.279

$30.580

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iodParts Technologies Inc.

India . 6,401 parts In-Stock

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Corphita

USA . 2,277 parts In-Stock

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Microchip USA

USA . 2,272 parts In-Stock

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Northwest PG Solutions

USA . 1,557 parts In-Stock

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Native Components

USA . 891 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the 74CB3Q3244DBQRE4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This bus driver and transceiver offers seamless connectivity and efficient data transmission, making it ideal for a wide range of applications. With its compact design and advanced technology, this product ensures reliable operation and optimal functionality. Upgrade your projects with this versatile solution that provides value, benefits, and advantages to customers seeking superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in transportation vehicles.

Propagation Delay At Nominal Supply: 0.2 ns

With a low propagation delay of 0.2 ns, this product ensures fast and efficient data transmission in bus driver and transceiver applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage is commonly used in industrial applications, ensuring compatibility with existing systems.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance control, reducing power consumption and enabling multiple devices to share the same bus lines.

Technical Specifications

Bus Driver & Transceivers 74CB3Q3244DBQRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

2 mA

Propagation Delay At Nominal Supply:

.2 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

3.9 mm

Trade Compliance

74CB3Q3244DBQRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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