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74AVCH16T245ZQLR

Texas Instruments

74AVCH16T245ZQLR by Texas Instruments

Texas Instruments 74AVCH16T245ZQLR is a bus driver with 2 functions, translating b/w 1.5/3.3V. It has a propagation delay of 6.2 ns and operates in industrial temperatures from -40 to 85°C. Ideal for bidirectional applications requiring common control, it comes in a compact grid array package with very thin profile and fine pitch terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 967 parts In-Stock

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VNN

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Digiode

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 127 parts In-Stock

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Nova Conductors

Japan . 85 parts In-Stock

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SPM Sales

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LWI Electronics Inc

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Distributors (Availability)

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Andel Nordic

Denmark . 566 parts In-Stock

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$2.450

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$2.352

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AZTECH Wire

Italy . 897 parts In-Stock

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Corohmni

South Africa . 187 parts In-Stock

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Semicontronic

India . 1,586 parts In-Stock

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Parana Technologies

USA . 1,093 parts In-Stock

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One Stop Electronics

USA . 943 parts In-Stock

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DigiPath Technology Company

USA . 318 parts In-Stock

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ChromeModa Solutions

Germany . 3,500 parts In-Stock

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IDEA Electronic Components Group

UK . 540 parts In-Stock

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$33.983

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$32.284

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$30.585

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Ampacity Inc.

Singapore . 262 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

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Microchip USA

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Overview

Elevate your electronic designs with the Texas Instruments 74AVCH16T245ZQLR bus driver & transceiver. Crafted with precision and expertise, this product offers superior quality and reliability that Texas Instruments is known for. Perfect for a wide range of applications, this versatile component provides seamless signal transmission and efficient data transfer. Experience the value and benefits of this top-of-the-line device, delivering exceptional performance and functionality to elevate your projects to new heights. Trust Texas Instruments for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is a durable and cost-effective material for packaging, ensuring the product is reliable and long-lasting.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional parts, saving space and simplifying design.

Translation: 1.5/3.3V&1.5/3.3V

This feature allows for voltage translation between different levels, making the product versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a nominal supply voltage of 1.5V makes the product energy-efficient and ideal for low-power applications.

Power Supplies (V): 1.5/3.3

Supporting multiple power supply voltages gives flexibility in system integration and compatibility with different components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch design enables high-density mounting, saving space on the PCB.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state, enabling multiple drivers to share a bus line without interference.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product suitable for use in harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers 74AVCH16T245ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.045 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

4.5 mm

Trade Compliance

74AVCH16T245ZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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