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74AVCB164245ZRDR

Texas Instruments

74AVCB164245ZRDR by Texas Instruments

74AVCB164245ZRDR by Texas Instruments is a Bus Driver & Transceiver with 8 bits and 2 functions. It operates at a nominal voltage of 1.5V, translating b/w 1.5/3.3V power supplies with a propagation delay of 6.8 ns, making it ideal for industrial applications requiring bidirectional control in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,225 parts In-Stock

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Digiode

USA . 1,883 parts In-Stock

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VNN

France . 1,054 parts In-Stock

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Chip Stock

USA . 355 parts In-Stock

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355

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Nova Conductors

Japan . 150 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 464 parts In-Stock

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$5.103

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-

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$4.899

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$4.899

464

$5.103

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$4.899

$4.899

Corohmni

South Africa . 246 parts In-Stock

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$8.178

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246

$8.178

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AZTECH Wire

Italy . 265 parts In-Stock

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$11.176

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$11.176

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Parana Technologies

USA . 1,341 parts In-Stock

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$21.947

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$22.463

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$21.947

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$22.463

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ChromeModa Solutions

Germany . 4,531 parts In-Stock

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$24.660

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$20.221

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$24.660

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IDEA Electronic Components Group

UK . 1,422 parts In-Stock

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$24.660

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$23.427

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$22.194

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Ampacity Inc.

Singapore . 338 parts In-Stock

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$31.000

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One Stop Electronics

USA . 1,298 parts In-Stock

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$37.000

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$37.000

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Semicontronic

India . 735 parts In-Stock

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$64.000

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$62.400

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$62.080

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735

$64.000

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GreenTree Electronics

Israel . 53,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,060 parts In-Stock

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Perfect Parts

USA . 3,263 parts In-Stock

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Corphita

USA . 2,765 parts In-Stock

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DigiPath Technology Company

USA . 2,378 parts In-Stock

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$22.233

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Argo Parts USA

USA . 830 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the high-quality 74AVCB164245ZRDR by Texas Instruments, a top-tier manufacturer known for cutting-edge Bus Driver & Transceivers. This versatile product offers seamless translation between 1.5V and 3.3V power supplies, making it ideal for a wide range of applications. With fast propagation delays, compact design, and reliable 3-STATE output characteristics, this component delivers exceptional value and performance to customers looking for efficient signal transmission solutions. Experience the benefits of superior technology and reliability with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 6.8 ns

The low propagation delay at nominal supply ensures fast and efficient data transmission in the bus driver & transceiver.

Surface Mount: YES

Being surface mountable makes the installation of the bus driver & transceiver convenient and space-saving in electronic circuits.

No. of Functions: 2

With 2 functions, this bus driver & transceiver offers versatility in managing and controlling data transmission.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement of the bus driver & transceiver within electronic systems.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle a wide range of data sizes efficiently.

Translation: 1.5/3.3V&1.5/3.3V

Supporting translation between different voltage levels makes this bus driver & transceiver compatible with various components in a circuit.

Nominal Supply Voltage / Vsup (V): 1.5

The nominal supply voltage of 1.5V ensures consistent and reliable performance of the bus driver & transceiver.

Power Supplies (V): 1.5/3.3

Support for multiple power supply voltages offers flexibility in the operation of the bus driver & transceiver.

No. of Terminals: 54

The 54 terminals provide ample connectivity options for interfacing the bus driver & transceiver with other components in a circuit.

Technical Specifications

Bus Driver & Transceivers 74AVCB164245ZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

5.5 mm

Trade Compliance

74AVCB164245ZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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