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74AVCB164245GRG4

Texas Instruments

74AVCB164245GRG4 by Texas Instruments

74AVCB164245GRG4 by Texas Instruments is a bus driver & transceiver with 8 bits, operating at 1.5V/3.3V. It features a propagation delay of 6.8 ns and supports true output polarity. Ideal for bidirectional applications in industrial settings due to its compact size and low power consumption of 0.08 mA at a max supply voltage of 3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,907 parts In-Stock

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Digiode

USA . 4,852 parts In-Stock

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Netsource Technology, Inc.

USA . 1,000 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 14 parts In-Stock

1+ parts

$2.765

100+ parts

-

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$2.654

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$2.654

14

$2.765

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$2.654

$2.654

AZTECH Wire

Italy . 491 parts In-Stock

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$16.741

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491

$16.741

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Parana Technologies

USA . 8 parts In-Stock

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$25.370

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$25.996

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8

$25.370

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$25.996

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DigiPath Technology Company

USA . 739 parts In-Stock

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$27.936

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739

$27.936

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ChromeModa Solutions

Germany . 6,525 parts In-Stock

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$28.506

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$23.375

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$28.506

$23.375

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IDEA Electronic Components Group

UK . 1,198 parts In-Stock

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$28.506

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$27.081

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$25.655

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1,198

$28.506

$27.081

$25.655

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One Stop Electronics

USA . 1,358 parts In-Stock

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$64.000

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QUARKTWIN TECHNOLOGY LTD

USA . 25,291 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Microchip USA

USA . 1,807 parts In-Stock

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Northwest PG Solutions

USA . 708 parts In-Stock

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Native Components

USA . 491 parts In-Stock

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Corphita

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Overview

Unlock seamless data transmission with the 74AVCB164245GRG4 from Texas Instruments. Crafted with precision and reliability, this bus driver & transceiver offers unparalleled performance for a wide range of applications. With a focus on quality and innovation, Texas Instruments ensures that customers receive a product that not only meets but exceeds their expectations. Experience faster propagation delay, versatile voltage translation, and efficient power management with this compact and powerful component. Elevate your projects with the value and benefits that the 74AVCB164245GRG4 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product ideal for use in various applications.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data transfer.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one component simplifies circuit design and reduces the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape helps in easy placement and alignment on the PCB, improving overall system layout.

No. of Bits: 8

8 bits provide sufficient data transmission capacity, making this product suitable for applications requiring moderate data processing.

Translation: 1.5/3.3V&1.5/3.3V

Support for multiple voltage translations ensures compatibility with a wide range of systems and devices.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage ensures consistent performance and reliable operation of the product.

No. of Terminals: 48

Having a high number of terminals allows for connectivity with multiple input and output devices, increasing versatility.

Output Characteristics: 3-STATE

3-STATE output allows the bus driver to control the bus line by driving it to a high impedance state, preventing conflicts in multi-master bus systems.

Technical Specifications

Bus Driver & Transceivers 74AVCB164245GRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

74AVCB164245GRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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