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74ALVCH16245ZQLR

Texas Instruments

74ALVCH16245ZQLR by Texas Instruments

74ALVCH16245ZQLR by Texas Instruments is a bus driver & transceiver with 3ns propagation delay, suitable for industrial applications. It features 8 bits, operates at 1.8V nominal voltage, and has a max operating temperature of 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,703 parts In-Stock

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Vyrian

USA . 4,514 parts In-Stock

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4,514

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ACDS - Activité Composants Distribution Service

France . 650 parts In-Stock

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650

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Semi Source

USA . 208 parts In-Stock

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208

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Microfarads

USA . 8 parts In-Stock

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8

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Bristol Electronics

USA . 4 parts In-Stock

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Parana Technologies

USA . 606 parts In-Stock

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$8.778

100+ parts

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$9.464

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606

$8.778

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$9.464

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DigiPath Technology Company

USA . 755 parts In-Stock

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$9.666

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$8.892

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755

$9.666

$8.892

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ChromeModa Solutions

Germany . 6,100 parts In-Stock

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$9.863

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$8.088

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$9.863

$8.088

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IDEA Electronic Components Group

UK . 278 parts In-Stock

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$9.863

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$9.370

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$8.877

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278

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$8.877

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AZTECH Wire

Italy . 200 parts In-Stock

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$13.726

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One Stop Electronics

USA . 1,190 parts In-Stock

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$22.000

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Native Components

USA . 623 parts In-Stock

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$76.540

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$73.478

623

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$73.478

Northwest PG Solutions

USA . 2,082 parts In-Stock

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$84.194

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Component Stockers USA

USA . 211 parts In-Stock

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$99.990

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Cyclops Electronics Ltd (Excess)

UK . 650 parts In-Stock

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650

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Microchip USA

USA . 335 parts In-Stock

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Corphita

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Overview

Experience seamless data transmission with the 74ALVCH16245ZQLR by Texas Instruments, a top-of-the-line Bus Driver & Transceiver offering unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product boasts a wide range of applications and benefits, guaranteeing optimal performance in various settings. With a focus on efficiency and value, this high-quality component ensures smooth operation and seamless connectivity, making it the ideal choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver/transceiver, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, streamlining circuit design and reducing costs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and use of space on the circuit board, optimizing layout and improving overall system performance.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage enhances energy efficiency and reduces power consumption, making this product ideal for battery-powered devices.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures compatibility with a wide range of devices and systems, enhancing versatility and flexibility in application.

Power Supplies (V): 3.3

Operating at a standard power supply voltage makes integration into existing systems straightforward and ensures compatibility with common power sources.

No. of Terminals: 56

Having a high number of terminals allows for greater connectivity options and flexibility in circuit design, enabling complex communication protocols to be implemented.

Maximum I (ol): 24 Amp

High maximum output current capability allows for driving of multiple loads or devices without the need for external amplification, simplifying system design.

Output Characteristics: 3-STATE

3-state output allows for tristate operation, providing flexibility in controlling bus lines and reducing the chance of bus contention in multi-master systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels, making this product suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, increasing the product's durability and longevity.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16245ZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

74ALVCH16245ZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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