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74ALVC164245DGGTE4

Texas Instruments

74ALVC164245DGGTE4 by Texas Instruments

74ALVC164245DGGTE4 by Texas Instruments is a bus driver & transceiver with 8 bits and 2 functions. It has a propagation delay of 5.8 ns and supports translation b/w 3V and 5V. This IC is commonly used in industrial applications due to its small size, low power consumption, and wide operating temperature range.

Median Price

$5.250

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$5.250

100+ parts

$2.690

1k+ parts

$1.740

10k+ parts

$1.690

246

$5.250

$2.690

$1.740

$1.690

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.580

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100

$1.580

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Vyrian

USA . 7,935 parts In-Stock

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VNN

France . 2,990 parts In-Stock

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Digiode

USA . 2,523 parts In-Stock

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2,523

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

$1.486

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1,000

$1.548

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$1.486

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Continental Prestige Electronics

USA . 1,994 parts In-Stock

1+ parts

$1.580

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$1.548

1,994

$1.580

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$1.548

Argo Parts USA

USA . 980 parts In-Stock

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$1.580

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$1.580

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Ampacity Inc.

Singapore . 184 parts In-Stock

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$3.370

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$3.370

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AZTECH Wire

Italy . 280 parts In-Stock

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$5.833

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Andel Nordic

Denmark . 310 parts In-Stock

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$7.684

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$7.377

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$7.377

310

$7.684

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$7.377

$7.377

Corohmni

South Africa . 224 parts In-Stock

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$17.810

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224

$17.810

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Parana Technologies

USA . 1,007 parts In-Stock

1+ parts

$20.384

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$20.415

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1,007

$20.384

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$20.415

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ChromeModa Solutions

Germany . 1,431 parts In-Stock

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$22.903

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$18.780

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1,431

$22.903

$18.780

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IDEA Electronic Components Group

UK . 711 parts In-Stock

1+ parts

$22.903

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$21.758

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$20.613

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711

$22.903

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$20.613

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Corphita

USA . 3,751 parts In-Stock

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DigiPath Technology Company

USA . 1,955 parts In-Stock

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$20.649

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1,955

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Microchip USA

USA . 1,886 parts In-Stock

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Overview

Discover the power of the 74ALVC164245DGGTE4 by Texas Instruments, a high-quality bus driver and transceiver that offers exceptional value and benefits. Manufactured by Texas Instruments, a leader in the industry, this versatile product is designed to provide reliable performance and seamless communication. Whether you need to drive or receive signals, this compact and efficient device delivers with its dual ports and bidirectional count direction. With its true output polarity and 3-state output characteristics, it ensures accurate and efficient data transmission. Perfect for a wide range of applications, this product is a game-changer in the world of electronics. Experience the advantages for yourself and unlock a new level of performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice offers durability and temperature resistance, making it suitable for various environments.

Propagation Delay At Nominal Supply: 5.8 ns

With a low propagation delay, this product ensures fast and efficient data transmission, increasing overall system performance.

Surface Mount: YES

Being surface mountable simplifies the installation process and allows for compact designs, optimizing space and reducing installation effort.

No. of Functions: 2

The inclusion of multiple functions in a single device enhances functionality, reducing the need for additional components and streamlining circuit designs.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in mounting and compatibility with standard equipment, facilitating integration into various systems.

No. of Bits: 8

Offering an 8-bit capacity, this product can handle larger data sets, enabling efficient transmission and processing of complex information.

Translation: 3V & 5V

The ability to translate between 3V and 5V voltage levels extends compatibility and allows integration with different systems and devices.

Nominal Supply Voltage / Vsup (V): 2.7

With a low nominal supply voltage, this product contributes to power efficiency and can operate within a wide voltage range.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable signal transmission and reduces the risk of signal degradation or distortion.

Power Supplies (V): 3.3,5

Supporting multiple power supply options, this product accommodates various system requirements, providing flexibility and compatibility.

No. of Terminals: 48

With a high terminal count, this product offers extensive connectivity options, enabling integration with multiple devices and systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact form factor and shrink pitch of this package style enhance space efficiency, enabling denser PCB layouts and more compact designs.

Maximum I (ol): 24 Amp

With a high maximum output current, this product can drive heavy loads, making it suitable for applications requiring robust and powerful signal transmission.

Propagation Delay (tpd): 7.6 ns

The specified propagation delay ensures quick signal propagation, reducing latency and facilitating time-sensitive operations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to withstand demanding environmental conditions, ensuring reliability and durability.

Output Characteristics: 3-STATE

The 3-state output characteristics provide the capability to establish high impedance states, enabling effective bus sharing and reducing signal interference.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables this product to function reliably in colder environments, expanding its range of possible applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold as terminal finishes enhances the product's resistance to corrosion and improves the longevity of electrical connections.

Terminal Position: DUAL

Featuring a dual terminal position, this product allows for flexibility in wiring configurations, supporting versatile installation options.

No. of Ports: 2

With dual ports, this product can handle bi-directional communication, providing greater versatility and enabling simultaneous data transfer between multiple devices.

Maximum Seated Height: 1.2 mm

The low maximum seated height ensures compatibility with space-constrained applications, making it suitable for compact designs or devices with limited clearance.

Width: 6.1 mm

The specified width contributes to a compact form factor, facilitating integration into space-limited applications and allowing for efficient use of board real estate.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation, minimizing errors and simplifying signal interpretation for downstream devices.

Minimum Supply Voltage (Vsup): 2.5 V

With a low minimum supply voltage, this product accommodates low-power applications and contributes to energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and reliability during assembly processes, streamlining production.

Peak Reflow Temperature °C: 260

The specified peak reflow temperature ensures compatibility with standard reflow soldering processes, simplifying manufacturing and ensuring proper soldering.

Length: 12.5 mm

The specified length provides compatibility with various design requirements and facilitates integration into different form factors or device placements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to operate reliably within a wide temperature range, making it suitable for rugged environments.

Technology: CMOS

Being based on CMOS technology, this product offers low power consumption, high noise immunity, and wide operating voltage range, making it reliable and versatile.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this product allows for easy soldering and reliable electrical connections, simplifying manufacturing processes.

Packing Method: TR

The product's tape and reel (TR) packing method ensures efficient handling and protects the components during transportation, contributing to streamlined production processes.

Terminal Pitch: 0.5 mm

With a small terminal pitch, this product supports high-density packaging, enabling miniaturization of devices and increasing circuit board capacity.

Count Direction: BIDIRECTIONAL

Supporting bidirectional counting, this product allows for flexible data transmission in both directions, adapting to various communication protocols.

Control Type: COMMON CONTROL

The common control feature simplifies system design by allowing multiple devices to be controlled using a shared control signal or interface.

Moisture Sensitivity Level (MSL): 1

The specified moisture sensitivity level ensures proper handling and storage of the product, maintaining its reliability during assembly and minimizing the risk of moisture-related failures.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage, this product can handle higher voltage applications, expanding its range of compatibility and versatility.

Maximum Power Supply Current (ICC): 0.04 mA

The low maximum power supply current contributes to energy efficiency and reduces power consumption, making it suitable for battery-powered or low-power applications.

Technical Specifications

Bus Driver & Transceivers 74ALVC164245DGGTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V TO 5.5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

6.1 mm

Trade Compliance

74ALVC164245DGGTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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